Growth of External Copper Layers During The Internal Oxidation of Dilute Cu-AI Alloys in a Cu2O-Cu Pack
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The thickness of external layers of pure copper formed on Cu-AI alloys during internal oxidation from a Cu20 source is shown to be related to the amount of oxygen absorbed according to the dissociation reaction of Cu20. No layers are formed during oxidation from NiO or CoO sources. Experimental data suggest that the CuoO is vaporized as molecules, which are dissociated at the oxygen absorbing surface.
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