, Volume 40, Issue 6, pp 8–13 | Cite as

VLSI Device Packaging

  • K. M. Striny
Feature Materials Technology


Wire Bonding Molding Compound Lead Frame Plastic Package Chip Carrier 


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Copyright information

© TMS 1988

Authors and Affiliations

  • K. M. Striny
    • 1
  1. 1.AT&T Bell LaboratoriesUSA

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