, Volume 40, Issue 6, pp 8–13 | Cite as

VLSI Device Packaging

  • K. M. Striny
Feature Materials Technology


Wire Bonding Molding Compound Lead Frame Plastic Package Chip Carrier 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© TMS 1988

Authors and Affiliations

  • K. M. Striny
    • 1
  1. 1.AT&T Bell LaboratoriesUSA

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