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AutoTechnology

, Volume 7, Issue 3, pp 34–37 | Cite as

Moulding technology for electronic components

  • Bettina Becker
  • Achim Schoeneweiss
Materials
  • 10 Downloads

Abstract

There has been a great increase in the importance of polyamide hotmelt adhesives, particularly over the last 20 years. This product group has been in use for several years for sealing electrical components in the automotive sector. Henkel recognizes the importance of these products in providing protection for printed circuit boards and electronics in vehicle electrical systems.

Keywords

Injection Moulding Softening Point Moulding Material Automotive Sector Glass Transition Range 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Reference

  1. [1]
    DIN 51005, Thermal analysis (TA) terms.Google Scholar
  2. [2]
    DIN 53765, Testing of plastics and elastomers; Thermal analysis; DSCmethod.Google Scholar
  3. [3]
    Heucher, R.; Filz, P.: Wasserdichte Autoelektronik, Kunststoffe 82 (1992) 9, S.825–829.Google Scholar

Copyright information

© Springer Fachmedien Wiesbaden GmbH 2007

Authors and Affiliations

  • Bettina Becker
    • 1
  • Achim Schoeneweiss
    • 1
  1. 1.HenkelGermany

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