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JOM

, Volume 44, Issue 7, pp 10–14 | Cite as

The past, present, and future of multilayer ceramic multichip modules in electronic packaging

  • Ananda H. Kumar
  • Rao R. Tummala
Multichip Module Packaging Featured Overview

Keywords

Cordierite Molybdenum Powder Multichip Module Multilayer Substrate Multilayer Ceramic 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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Copyright information

© TMS 1992

Authors and Affiliations

  • Ananda H. Kumar
    • 1
  • Rao R. Tummala
    • 1
  1. 1.First Level Packaging LaboratoryIBM Technology ProductsEast FishkillUSA

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