Gold Bulletin

, Volume 5, Issue 2, pp 26–30 | Cite as

Gold in thick film hybrid microelectronics

  • R. G. Finch
Open Access


For a number of years microelectronic components have been made by screen printing patterns of resistive, conductive, insulating and dielectric pastes on to ceramic wafers and firing these in air to temperatures between 700 and 1000°C. Such thick film microcircuits are relatively inexpensive to make and offer a wide range of component values with good stable electrical properties. They have, therefore, found wide acceptance in industry and a substantial and increasing volume of thick film circuits is now being made.


Thick Film Glass Powder Conductor Film Sheet Resistivity Cent Gold 
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Copyright information

© World Gold Council 1972

Authors and Affiliations

  • R. G. Finch
    • 1
  1. 1.The Electrical Research AssociationLeatherheadEngland

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