Gold Bulletin

, Volume 8, Issue 1, pp 13–15 | Cite as

A new generation of thick-film gold conductor pastes

Improved properties of glass-free preparations
Open Access


Good adhesion, high conductivity, ease of bonding and compatibility with other components are the characteristics of new types of gold conductor pastes for screen printing on to ceramics substrates.


Gold Film Screen Printing Ceramic Substrate Peel Test Gold Metallisation 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


  1. 1.
    R. G. Finch, “Gold in Thick-Film Hybrid Microelectronics”, Gold Bull., 1972, 5, (2), 96Google Scholar
  2. 2.
    R. G. Loasby, N. Davey and H. Barlow, “Enhanced Property Thick-Film Conductor Pastes”, Solid State Tech,. 1972, 15, (5), 46Google Scholar
  3. 3.
    B. R. Smith and R. L. Dietz, “An Innovation in Gold Paste”, Proc. ISHM Symp., 1972, p. 2-A-5-1Google Scholar
  4. 4.
    S. K. Misra and A. C. D. Chaklader, J. Am. Ceram. Soc., 1963, 46, (10), 509CrossRefGoogle Scholar
  5. 5.
    T. T. Hitch, “Adhesion, Phase Morphology and Bondability of Reactively-Bonded and Frit Bonded Gold and Silver Thick-Film Conductors”, J. Elect. Mat., 1974, 3, (2), 553CrossRefGoogle Scholar
  6. 6.
    B. R. Smith, U.S. Patents 3,799,890 and 3,799,891 and others pendingGoogle Scholar
  7. 7.
    R. H. Zeien, “Characterisation of Thick Film Fritless Metallisation”, Proc. ISHM Symp., 1974, p. 7Google Scholar

Copyright information

© World Gold Council 1975

Authors and Affiliations

  • T. H. L.

There are no affiliations available

Personalised recommendations