Gold Bulletin

, Volume 21, Issue 2, pp 59–68 | Cite as

Lubrication with thin gold films

  • M. Antler
  • T. Spalvins
Open Access


Gold Lubricants Come of Age in Aerospace Bearing and Electronic Contact Applications


Gold Film Metallic Film Pure Gold Thin Gold Film Nickel Substrate 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


  1. 1.
    F.P. Bwoden and D. Tabor,Friction and Lubrication of Solids, part I, Clarendon Press, Oxford, 1950, 111–21Google Scholar
  2. 2.
    D.H. Buckly,Surface Effects in Adhesion, Friction, Wear and Lubrication, Tribology Series 5, Elsevier, 1981, 324–337Google Scholar
  3. 3.
    D.M. Mattox, ‘Ion Plating Technology’,Deposition Technologies for Films and Coatings, (ed., R.F. Bunshah), Noyes Publications, Park Ridge, IL, 1982, 244–87Google Scholar
  4. 4.
    D.M. Mattox, ‘Mechanisms of Ion Plating’,Proceedings of the International Conference on Ion Plating and Allied Techniques, IPAT 79, CEP Consultants Ltd., Edinburgh, England, 1979, 1–10Google Scholar
  5. 5.
    T. Spalvins, ‘Survey of Ion Plating Sources’,J. Vac. Sci. Technol., 1980,17, 315–21CrossRefGoogle Scholar
  6. 6.
    K. Miyoshi, T. Spalvins and D.H. Buddy, ‘The X-Ray Photoelectron Spectroscopy Depth Profiling and Tribological Characterization of Ion-Plated Gold on Various Metals’,Thin Solid Films, 1983,108, 199–207CrossRefGoogle Scholar
  7. 7.
    K. Miyoshi, T. Spalvins and D.H. Buckley, ‘Tribological Characteristics of Gold Films Deposited on Metals by Ion Plating and Vapor Deposition’,3rd Int. Conf. on Solid Lubrication, ASLE SF-14, ASLE, Park Ridge, IL, 1984, 208–16Google Scholar
  8. 8.
    T. Spalvins, ‘Coatings for Wear and Lubrication,Thin Solid Films, 1978,53, 285–300CrossRefGoogle Scholar
  9. 9.
    G.S.A. Shawki, M.G. El-Sherbiny and F.B. Salem, ‘Nucleation and Interface Formation in Thin Films’,Thin Solid Films, 1981,75, 29–36CrossRefGoogle Scholar
  10. 10.
    F.H. Reid and W. Goldie,Gold Plating Technology, Eds., Electrochemical Publications Ltd., Ayr, Scotland, 1974, chapter by E.A. Parker on ‘Immersion Solutions’, 73–82Google Scholar
  11. 11.
    F.H. Reid and W. Goldie,Gold Plating Technology, Eds., Electrochemical Publications Ltd., Ayr, Scotland, 1974, chapter by Y. Okinada on ‘Electroless Solutions’, 82–104Google Scholar
  12. 12.
    Gold/1987, Consolidated Gold Fields, New York, NYGoogle Scholar
  13. 13.
    F.H. Reid and W. Goldie,Gold Plating Technology, Eds., Electrochemical Publications Ltd., Ayr, Scotland, 1974, chapter by W.K.A. Congreve on ‘Pretreatment and Plating Procedures’, 105–142Google Scholar
  14. 14.
    F.H. Reid and W. Goldie,Gold Plating Technology, Eds., Electrochemical Publications Ltd., Ayr, Scotland, 1974, chapter by F.H. Reid on ‘Measurement of Adhesion’, 422–429Google Scholar
  15. 15.
    T. Spalvins and B. Buzek, ‘Frictional and Morphological Characteristics of Ion-Plated Soft Metallic Films’,Thin Solid Films, 1981,84, 267–72CrossRefGoogle Scholar
  16. 16.
    R.D. Arnell and F.A. Soliman, ‘The Effects of Speed, Film Thickness and Substrate Surface Roughness on the Friction and Wear of Soft Metal Films in Ultrahigh Vacuum’,Thin Solid Films, 1978,53, 333–41CrossRefGoogle Scholar
  17. 17.
    M.A. Sherbiny and J. Halling, ‘Friction and Wear of Ion-Plated Soft Metallic Films’,Wear, 1977,45, 211–20CrossRefGoogle Scholar
  18. 18.
    T. Sato, Y. Matsui, M. Ukada, K. Murakawa and Z. Henmi, ‘Palladium with a Thin Gold Layer as a Sliding Contact Material’,IEEE Trans. on Components, Hybrids, and Manufacturing Techn., 1981, CHMT-4(1), 10–14CrossRefGoogle Scholar
  19. 19.
    F.I. Nobel, ‘Electroplated Palladium — Silver (60/40 wt.%) Alloy as a Contact Material’,IEEE Trans. on Components, Hybrids, and Manufacturing Techn., 1985,CHMT-8(1), 163–72CrossRefGoogle Scholar
  20. 20.
    S.W. Updegraff, ‘Better than Gold; A Palladium-Nickel Coating System for High Reliability Connectors’,Proc. 33rd Electronic Components Conf., IEEE-CHMT Soc. and EIA, Orlando, FL, 1983, 425–31Google Scholar
  21. 21.
    R.G. Baker and T.A. Palumbo, ‘The Potential Role of Ruthenium for Electronic Applications’,Plating and Surface Fin, 1982,69(1), 66–68Google Scholar
  22. 22.
    M. Antler, ‘Sliding Wear of Metallic Contacts’,IEEE Trans. on Components, Hybrids, and Manufacturing Techn., 1981,CHMT-4(1), 15–29CrossRefGoogle Scholar
  23. 23.
    C.A. Holden, R.L. Opila, H.H. Law and G.R. Crane, ‘Wear Resistance of Nickel and Nickel Phosphorus Alloy Electrodeposits’,Proc. IEEE-Holm Conference on Electrical Contacts, IEEE-CHMT Soc., San Francisco, CA, 1988Google Scholar
  24. 24.
    M. Antler and M. Feder, ‘Wear and Friction of Electrodeposited Palladium Contacts: Thin Film Lubrication with Fluids and with Gold’,IEEE Trans. on Components, Hybrids, and Manufacturing Techn., 1986,CHMT-9(4), 485–91CrossRefGoogle Scholar
  25. 25.
    F.E. Bader, ‘Diffused Gold R-156: A new Inlay Contact Material for Bell System Connectors’,Proc. Int. Conf. on Electric Contact Phenomena, Verband Deutscher Elektrotechniker (VDE), West Berlin, Germany, 1982, 133–37Google Scholar
  26. 26.
    W.H. Safranek,The Properties of Electrodeposited Metals and Alloys, 2nd ed., American Electroplaters and Surface Finishers Soc., Orlando, FL, 1986, 163–94Google Scholar
  27. 27.
    F.P. Bowden and D. Tabor,The Friction and Lubrication of Solids, part II, Oxford, Clarendon Press, 1964, 56Google Scholar
  28. 28.
    Y. Okinaka, F.B. Koch, C. Wolowodiuk and D.R. Blessington, ‘Polymer Inclusions in Cobalt-Hardened Electroplated Gold’,J. Electrochem. Soc., 1978,125(11), 1745–50CrossRefGoogle Scholar
  29. 29.
    Y. Okinaka and S. Nakahara, ‘Structure of Electroplated Hard Gold Observed by Transmission Electron Microscopy’,J. Electrochem. Soc., 1976,123(9), 1284–89CrossRefGoogle Scholar
  30. 30.
    M. Antler, ‘Structure of Polymer Codeposited in Gold Electrodeposits’,Plating, 1973,60(5), 468–74Google Scholar
  31. 31.
    S.M. Garte, ‘Effect of Substrate Roughness on the Porosity of Gold Electrodeposits’,Plating, 1966,53, 1335–39Google Scholar

Copyright information

© World Gold Council 1988

Authors and Affiliations

  • M. Antler
    • 1
  • T. Spalvins
    • 2
  1. 1.AT&T Bell LaboratoriesColumbus
  2. 2.Lewis Research CenterNational Aeronautics and Space AdministrationCleveland

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