ESEEM of copper complexes formed in the interlayer between thiokol-epoxy adhesive and brass substrate
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Copper complexes formed in the interlayer between the thiokol-epoxy adhesive and a brass substrate were studied by electron spin echo envelope modulation. The goal of the study was to help gain better understanding of the nature of the adhesion mechanism of polymer macromolecules with the brass substrate. Previous investigations revealed that square-planar copper complexes with sulphur-containing ligands form in the interlayer. However, a detailed structure of the copper-sulphur complex was not known. To get structural information we used a method that can be applied for weakly coupled nuclei with axially symmetric hyperfine interactions. The number of protons near the copper complex was estimated. Observation of nitrogen nuclei in the copper complex structure confirmed an earlier conjecture that dimethylaminomethylphenol acts as an initiator. The structure of the copper complex formed in the interlayer between the thiokol-epoxy adhesive and the brass substrate was proposed.
KeywordsElectron Paramagnetic Resonance Spectrum Copper Complex Nuclear Quadrupole Resonance Microwave Pulse Electron Spin Echo Envelope Modulation
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