Abstract
A class of full-wave models useful to tackle emc problems in passive mmic structures, as well as in conventional electronic circuitry, employed in wireless technology applications is presented. Upon using the appropriate dyadic Green’s function, the prediction of undesired emi effects, a widely addressed problem in high package-density modules, is performed by accounting for both electromagnetic coupling and surface/volume wave excitation. Particular efforts have been devoted to the simulation of circuits in realistic exciting/loading situations through the derivation of equivalent network representations. The resulting full-wave models allow an accurate prediction of possible emc problems in mmics already during the design stage, thus paving the way to low-cost solutions for emi reduction.
Résumé
Une classe de modèles dynamique apte à traiter des problèmes de compatibilité électromagnétique dans les structures passives, dans les circuits intégrés hyperfrequences, mais également dans les circuits électroniques classiques, utilisés en télécommunication sansfil est présentée. Grâce à l’utilisation de la fonction de Green dyadique appropriée, il est possible de déterminer les effets indésirables des perturbations électromagnetiques, qui constituent un problème dans les modules à haute densité d’intégration, en tenant compte à la fois des couplages électromagnétiques et des excitations par ondes de surfaces et de volume. Des efforts particuliers ont été consacrés à la simulation de circuits dans les situations réalistes d’excitation et de charges avec établissement de réseaux électriques équivalents. Les modèles obtenus permettent de simuler avec précision les éventuels problèmes de cem dans les circuits intégrés hyperfréquences, et ceci dès la phase de conception, ouvrant ainsi la voie à des solutions à bas coût pour la réduction des effets des perturbations électromagnetiques.
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References
***. Numerical techniques for microwave and millimeter-wave passive structures. Edited by Itoh (T.).John Wiley & Sons, New York (1989).
Hirano (M.), Nlshlkawa (K.), Toyada (I.), AOYAMA (S.), Sugitani (S.), Yamasaki (K.). Three-dimensional passive circuit technology for ultra-compact mmic’s.IEEE Trans. MTT (Dec. 1995),43, no 12, pp. 2845–2850.
Lakin (K. M.), Kline (G. R.), McCarron (K. T.). Development of miniature filters for wireless applications.IEEE Trans. MTT (Dec. 1995),43, no 12, pp. 2933–2939.
Nair (V.), Tehrani (S.), Vaitkus (R. L.), Scheitlin (D. G.). Low power hfet down converter mmic’s for wireless communication applications.IEEE Trans. MTT(Dec. 1995),43, no; 12, pp. 3043–3047.
Nakano (H.), Kerner (S. R.), Alexopoulos (N. G.). The moment method solution for wire antennas of arbitrary configuration.IEEE Trans. AP (Dec. 1988),36, no 12, pp. 1667–1674.
Michalski (K. A.), Zheng (D.). Electromagnetic scattering and radiation by surfaces of arbitrary shape in layered media, Part I: theory.IEEE Trans. AP (Mar. 1990),38, no; 3, pp. 335–344.
Wu (S. C), Alexopoulos (N. G.). Broadband microstrip antennas on electrically thick substrates.J. Electromag. Waves Applicat. (1993),7, no; 1, pp. 123–146.
Wang (T.), An (H.), Wu (K.), Laurin (J.), Bosisio (R.). Spectraldomain analysis of radiating cylindrical dielectric resonators for wireless applications.IEEE Trans. MTT (Dec. 1995),43, no 12, pp. 2959–2964.
Balzano (Q.), Bernardi (P.), Cicchetti (R.), Faraone (A.). Planar antennas for portable telephones : performance and interaction characteristics.Invited paper at XXV URSI General Assembly, Lille, France (Aug. 28–Sept. 5, 1996).
Ott (H. W.). Noise reduction techniques in electronic systems.John Wiley Interscience, New York (1986).
Paul (C. R.). Modeling electromagnetic interference properties of printed circuit boards.IBM J. of Research and Development (Jan. 1989),33, no 1, pp. 33–50.
Smith (T. S.), Paul (C. R.). Effect of grid spacing on the inductance of ground grids.Proc. IEEE Int. Symp. Electromag. Compat. (1991), pp. 72–77.
Paul (C. R.). Introduction to electromagnetic compatibility.John Wiley, New York (1992).
Rubin (B. J.), Bertoni (H. L.). Waves guided by conductive strips above a periodically perforated ground plane.IEEE Trans. MTT (July 1983),31, no 7, pp. 541–549.
Rubin (B. J.). The propagation characteristics of signal lines in a mesh-plane environment.IEEE Trans. MTT (May 1984),32, no; 5, pp. 522–531.
Chan (C. H.), Mittra (R.). The propagation characteristics of signal lines embedded in a multilayered structure in the presence of a periodically perforated ground plane.IEEE Trans. MTT (June 1988),36, no 6, pp. 968–975.
Pan (G.), Zhu (X.), Gilbert (B. K.). Analysis of transmission lines of finite thickness above a periodically perforated ground plane at oblique orientation.IEEE Trans. MTT (Feb. 1995),43, no 2, pp. 383–393.
Bernardi (P.), Cicchetti (R.), Faraone (A.). A full-wave characterization of an interconnecting line printed on a dielectric slab backed by a gridded ground plane.IEEE Trans. EMC (Aug. 1996),38, no; 3, pp. 237–243.
Raut (R.), Steenaart (W.), Costache (G. I.). A note on the optimum layout of electronic circuits to minimize the radiated electromagnetic field strength.IEEE Trans. EMC (Feb. 1988),30, no; 1, pp. 88–89.
Kiang (J. F.). On the resonances and shielding of printed traces on a circuit board.IEEE Trans. EMC (Nov. 1990),32, no 4, pp. 269–276.
Bernardi (P.), Cicchetti (R.). Dyadic Green’s functions for conductor-backed layered structures excited by arbitrary tridimensional sources.IEEE Trans. MTT (Aug. 1994),42, no 8, pp. 1474–1483.
Barkeshli (S.), Pathak (P. H.). On the dyadic Green’s function for a planar multilayered dielectric/magnetic media.IEEE Trans. MTT (Jan. 1992),40, no 1, pp. 128–142.
Pan (S.), Wolff (I.). Scalarization of dyadic spectral Green’s functions and network formalism for three-dimensional full-wave analysis of planar lines and antennas.IEEE Trans. MTT (Nov. 1994),42, no 11, pp. 2118–2127.
Bernardi (P.), Cicchetti (R.), Moreolo (D. S.). A full-wave model for EMI prediction in planar microstrip circuits excited in the near-field of a short electric dipole.IEEE Trans. EMC (May 1995),37, no 2, pp. 175–182.
Warne (L. K.), Chen (K. C.) Relation between equivalent antenna radius and transverse line dipole moments of a narrow slot aperture having depth.IEEE Trans. EMC (Aug. 1988),30, no 3, pp. 364–370.
Chen (Y. G.), Crumley (R.), Lloyd (S.), Baum (C. E.). Fieldcontaininginductors.IEEE Trans. EMC (Aug. 1988),30, no 3, pp. 345–351.
Okoshi (T.). Planar circuits for microwave and lightwaves. Series in electrophysics, vol. 18,Springer, Berlin (1985).
] Gupta (K. C), Abouzahra (M. D.). Analysis and design of planar microwave components.IEEE Press (1994).
Katehi (P. B.), Alexopoulos (N. G.). Frequency-dependent characteristics of microstrip discontinuities in millimeter-wave integrated circuits.IEEE Trans. MTT (Oct. 1985),33, no 10, pp. 1029–1035.
Jackson (R. W.), Pozar (D. M.) Full-wave analysis of microstrip open-end and gap discontinuities.IEEE Trans. MTT (Oct. 1985),33, no 10, pp. 1036–1042.
Pozar (D. M.), Voda (S.M.). A rigorous analysis of a microstripline fed patch antenna.IEEE Trans. AP (Dec. 1987),35, no 12, pp. 1343–1350.
Gothelf (U. V.), østergaard (A.). Full-wave analysis of a twoslot microstrip filter using a new algorithm for computation of the spectral integrals.IEEE Trans. MTT (Jan. 1993),41, no 1, pp. 101–108.
Alexopoulos (N. G.), Yang (H. Y). Basic blocks for highfrequency interconnects: theory and experiment.IEEE Trans. MTT (Aug. 1988),36, no 8, pp. 1258–1264.
Alexopoulos (N. G.), Jackson (D. R.), Yang (H. Y). Microstrip open-end and gap discontinuities in a substrate-superstrate structure.IEEE Trans. MTT (Oct. 1989),37, no 10, pp. 1542–1546.
Alexopoulos (N. G.), Wolff (I.), Wu (S. C), Yang (H. Y). A rigorous dispersive characterization of microstrip cross and T junctions.IEEE Trans. MTT (Dec. 1990),38, no 12, pp. 1837–1844.
Cicchetti (R.), Faraone (A.). An expansion function suited for fast full-wave spectral-domain analysis of microstrip discontinuities.Int. J. MIM1CAE (July 1994),4, no 3, pp. 297–306.
Cicchetti (R.), Faraone (A.). A full-wave spectral domain analysis of an asymmetric gap microstrip discontinuity.Microwave Opt. Tech. Letters (Aug. 1995),9, no 6, pp. 356–358.
Harokopus (W. P.), Kathei (P. B.). Characterization of microstrip discontinuities on multilayer dielectric substrates including radiation losses.IEEE Trans. MTT (Dec. 1989),37, no 12, pp. 2058–2066.
Mosig (J. R.). Arbitrarily shaped microstrip structures and their analysis with a mixed potential integral equation.IEEE Trans. MTT (Feb. 1988),36, no 2, pp. 314–323.
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Bernardi, P., Cicchetti, R. & Faraone, A. EMC-oriented full-wave modelling of passive MMIC structures for wireless applications. Ann. Télécommun. 52, 155–163 (1997). https://doi.org/10.1007/BF02996040
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DOI: https://doi.org/10.1007/BF02996040
Key words
- Modelling
- Microwave integrated circuit
- Monolithic integrated circuit
- Electromagnetic compatibility
- Planar technology
- Electromagnetic coupling
- Green function
- Microstrip line
- Discontinuity
- Printed circuit
- Conducting plane
- Frequency domain method
- Telecommunication application
- Radiocommunication