Abstract
Materials are either removed from or added to a device, usually in a selective manner with using thin and/or thick film manufacturing processes that transfer the lithographic patterns into integrated circuits (ICs) or three-dimensional micromachines. This study deals with material removal by chemically assisted mechanical micromachining. Two methods are used chemical mechanical machining method are introduced in this paper. One, mechanically assisted chemical etching, is applied to fabricate a micro beam such as cantilever, and another is chemically assisted mechanical micromachining to fabricate microstructure such as micropattern, microchannel. The results are discussed.
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References
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Park, J., Jeong, H. A study on the fabrication of micro groove on SI wafer using chemical mechanical machining. J Mech Sci Technol 19, 2096–2104 (2005). https://doi.org/10.1007/BF02916504
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DOI: https://doi.org/10.1007/BF02916504