Metallurgical and Materials Transactions A

, Volume 31, Issue 11, pp 2867–2875 | Cite as

Thermal stability of electroless-nickel/solder interface: Part B. Interfacial fatigue resistance

  • Pi Lin Liu
  • Jian Ku Shang


The relationship between fatigue resistance and interfacial microstructure was studied along the interface between the Sn-Pb eutectic alloy and an electroless Ni-P coating. The fatigue resistance of the solder interface was measured from the flexural peel fracture mechanics specimens in the asreflowed, mild-aged, and overaged conditions. While the mild aging had only a marginal effect on the fatigue resistance of the interface, overaging was found to significantly degrade the interfacial resistance to fatigue-crack growth, resulting in a lower fatigue threshold and a much earlier onset of the fast fracture. The effects of the overaging were shown to result from the transformation of the interfacial microstructure, which weakened the crack-sliding resistance in the near-threshold regime and embrittled the interface in the high crack-growth rate regime.


Material Transaction Solder Alloy Fatigue Resistance Interfacial Microstructure Overaged Condition 


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Copyright information

© The Minerals, Metals & Materials Society - ASM International - The Materials Information Society 2000

Authors and Affiliations

  • Pi Lin Liu
    • 1
  • Jian Ku Shang
    • 1
  1. 1.the Department of Materials Science and EngineeringUniversity of Illinois at Urbana-ChampaignUrbana

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