A study on the stability of channel electron multipliers
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A method to test the stability of high lead glass CEM is given and some results are obtained. The life-test datum with an accumulative count about 1011 is obtained; the structure and composition of active surface of fatigued CEM are analyzed by using AES. We find the increase of carbon on the active surface is the main cause for the decrease of the CEM gain through the life-test. The thickness of contaminating, carbon layer is approximately 50Å. In order to improve CEM’s bake-resisting property, we have also studied the effects of the baking temperature on the gain and FWHM, and the relationship between the baking temperature and the reduction temperature. We find, under the condition of keeping the resistivity constant for a period of time, the higher the reduction temperature is, the higher the bake-resisting temperature will be.
KeywordsActive Surface Reduction Temperature Electron Bombardment Cumulative Count Channel Electron Multiplier
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