Abstract
The thermal stresses that may develop due to crystal anisotropy within the microstructure of beryllium and certain other hcp materials are described. The magnitude of the unrelaxed thermal stress in polycrystalline beryllium is estimated numerically. The calculated values for the local thermal stresses that might occur in polycrystalline beryllium are comparable to the bulk stresses that are measured for yielding and fracture. The possible influence of these stresses on the initiation of cleavage cracks in rolled beryllium sheet and in extruded beryllium plate is described.
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N. R. Borch, formerly with Lawrence Radiatior. Laboratory, University of California, Livermore, Calif.
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Armstrong, R.W., Borch, N.R. Thermal microstresses in beryllium and other HCP materials. Metall Trans 2, 3073–3077 (1971). https://doi.org/10.1007/BF02814957
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DOI: https://doi.org/10.1007/BF02814957