Stress states for {123} <111> multiple slip

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Bell Telephone Laboratories, Murray Hill, N.J.
G. Y. Chin (Member of the Technical Staff) & B. C. Wonsiewicz (Member of the Technical Staff)

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G. Y. Chin
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B. C. Wonsiewicz
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Chin, G.Y., Wonsiewicz, B.C. Stress states for {123} <111> multiple slip. Metall Trans 1, 551–556 (1970). https://doi.org/10.1007/BF02811577

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