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Holz als Roh- und Werkstoff

, Volume 50, Issue 10, pp 395–399 | Cite as

Modelling of the moisture transfer process in particleboards

  • Cai Liping
  • Shang Deku
Article

Abstract

There were a number of studies on moisture transfer modelling of wood, but no systematic study for moisture transfer in particleboard with respect to usage or storage. The physical parameters of four kinds of particleboards were determined in this study. The unsteady-state diffusion coefficients and surface emission coefficients of moisture in particleboards were separated in one experimental period by using the method of linear regression. Then the moisture transfer processes in particleboard were analysed by using Finite Element Method (FEM), and the moisture absorption processes of four kinds of particleboards were observed experimentally. By comparing the computed results with the experimental results, it showed that the error was within 10%. Therefore, we came to the conclusion that the processes of moisture transfer in particleboard can be described by using FEM:

Keywords

Finite Element Method Nodal Point Moisture Transfer Moisture Diffusion Coefficient Provent 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Simulation des Wassertransports in Spanplatten

Zusammenfassung

Im Gegensatz zum Holz, liegen für Spanplatten noch keine systematischen Untersuchungen des Wassertransports vor. In dieser Arbeit wurden für vier Plattentypen die physikalischen Eigenschaften bestimmt. Diffusions-Koeffizienten und Koeffizienten für den Wasseraustritt aus der Oberfläche wurden über Regressions-analysen getrennt erfaßt. Die Feuchtebewegung innerhalb der Platten wurde darauf nach der Finite-Element-Methode (FEM) simuliert und mit der Wasseraufnahme der vier Plattentypen verglichen. Die Abweichungen der berechneten von den experimentell bestimmten Werten lagen im Bereich von 10%. Die FEM erweist sich daher als geeignet, die Wasserbewegung innerhalb von Spanplatten zu beschreiben.

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References

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Copyright information

© Springer-Verlag 1992

Authors and Affiliations

  • Cai Liping
    • 1
  • Shang Deku
    • 1
  1. 1.Forest Products DepartmentNortheast Forestry UniversityHarbinChina

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