Zusammenfassung
Es wurden Struktur- und Prozeßeinflußgrößen, welche die mechanischen Eigenschaften von Spanplatten beeinflussen, untersucht. Daraus wurden Gleichungen zwischen Biegeelastizitätsmodul und Querzugfestigkeit einerseits und Prozeßparametern andererseits abgeleitet. Diese Gleichungen, aus einer Reihe früherer Untersuchungen abgleitet, ermöglichen es, die Wirkungen einer Reihe von Prozesßparametern auf die Eigenschaften von 12 mm dicken Platten zu simulieren.
Abstract
Physical and process manufacturing factors affecting the properties of particleboard were examined and mathematical relationships were derived to predict board modulus of elasticity and internal bond. The equations, derived from a series of previous laboratory investigations, allow the simulation of the effects of various process conditions on final properties of 1/2-inch (12-mm) boards.
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Spelter, H., Torresani, P. Mathematisch-statistische Simulierung der mechanischen Eigenschaften von Bauspanplatten. Holz als Roh-und Werkstoff 49, 251–257 (1991). https://doi.org/10.1007/BF02627550
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DOI: https://doi.org/10.1007/BF02627550