Abstract
A geometrically nonlinear analysis was proposed for the deformation of a free standing elastically isotropic wafer caused by the surface stress change on one surface. The link between the curvature and the change in surface stress was obtained analytically from energetic consideration. In contrast to the existing linear analysis, a remarkable consequence is that, when the wafer is very thin or the surface stress difference between the two major surfaces is large enough, the shape of the wafer will bifurcate.
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Contributed by Lupiu Ren-huai
Biography: Yupan Kun (1979≈)
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Kun, Y., Ling-hui, H. & Ren-huai, L. Shape bifurcation of an elastic wafer due to surface stress. Appl Math Mech 24, 1141–1146 (2003). https://doi.org/10.1007/BF02438103
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DOI: https://doi.org/10.1007/BF02438103