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Nanometer-scale chemical compatibility between nickel aluminide and MgO films

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Abstract

The stability of the NiAl/MgO interface at temperatures in the range 800–1000‡C was studied on layered thin films of MgO/(Ni+Al)/MgO, using electron diffraction in transmission electron microscopy, and X-ray photoelectron spectroscopy. NiAl was formed by rapid thermal annealing (RTA) of the films at 300‡C, without affecting the interface. RTA at 800‡C, for 5 min induced a limited interfacial reaction which formed a spinel phase and Ni3Al, but left most of the NiAl and MgO layers intact. In the earliest reaction stages, aluminium diffuses out from, and oxygen diffuses into NiAl. After RTA at 1000‡C for 100s, the NiAl layer disintegrates completely, while the magnesium apparently evaporates from the MgO. While the NiAl/MgO system is shown to be chemically incompatible on the nanoscale, comparison with other aluminide/reinforcement systems shows it to be one of the more stable ones.

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Author notes

  1. M. Nathan

    Present address: Faculty of Engineering, Tel-Aviv University, Israel

Authors and Affiliations

  1. Martin Marietta Laboratories, 1450 South Rolling Road, 21227, Baltimore, MD, USA

    M. Nathan, C. R. Anderson & J. S. Ahearn

Authors
  1. M. Nathan
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  2. C. R. Anderson
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  3. J. S. Ahearn
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Nathan, M., Anderson, C.R. & Ahearn, J.S. Nanometer-scale chemical compatibility between nickel aluminide and MgO films. JOURNAL OF MATERIALS SCIENCE 29, 5887–5891 (1994). https://doi.org/10.1007/BF00366872

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  • DOI: https://doi.org/10.1007/BF00366872

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