Parametric Investigation of Metals (Au, Ag, Pt and Cu) Using Analytical Hierarchy Process

  • Muhammad Asif
  • Faiz Rasool
  • Zubair ButtEmail author
  • Muhammad Shahzad
  • Nouman Ahmad
  • Abdul Rehman Chishti
Regular Paper


Metals especially gold, silver, platinum and copper are getting more attention for application in electronics field due to their versatile properties. In this paper, we selected the materials after comparison on the basis of their significant properties. Those properties are conductivity, physical properties, reactivity, cost and demand and supply. We investigate the conductivity of metals at various temperature values, their historically monthly prices along with their worldwide demand and supply. First, we compare their conductivity and resistivity for various values of temperature as well as by adding impurity into them. Secondly, we examined their responses when they are in contact with the atmosphere, their historically monthly prices, availability in the earth crust, and a brief discussion on the structure of these metals. These metals are widely used in electronics and jewelry because of their good conductivity, chemical stability and long lasting. We implemented the analytical hierarchy process for the parametric investigation of these metals which is a general theory of measurement. It has been used to derive ratio scales from both continuous and discrete paired comparison. This comparison is taken from actual measurement which reflects the relative strength of preferences. The metals are also useful to design electrical stimulator with low-frequency current to regulate the blood of the human body. By using the stimulator at acupuncture points to pass through small electrical signal is useful to control blood flow in the human body as well as provides relief in pain.


Metals Conductivity Electrical resistivity Reactivity Analytical hierarchy process (AHP) 



Analytical hierarchy process




Electrical and electronic equipment


Face centered cubic


Gold field mineral services


Integrated circuit


International copper study group


London bullion market


Printed circuit board


Radio frequency identification tags


South Africa


United States geological survey


United State of America

List of symbols

Electrical resistivity


Total electrical resistivity


Electrical resistivity at nominal temperature

ideal (T)

Electrical resistivity at temperature T






Thermal energy transfer rate


Thermal conductivity


Cross sectional area


Temperature gradient


Thermal conduction


Lattice constant


Atomic radius




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Copyright information

© The Korean Institute of Electrical and Electronic Material Engineers 2018

Authors and Affiliations

  • Muhammad Asif
    • 1
  • Faiz Rasool
    • 1
  • Zubair Butt
    • 1
    Email author
  • Muhammad Shahzad
    • 1
  • Nouman Ahmad
    • 1
  • Abdul Rehman Chishti
    • 1
  1. 1.Department of Mechatronics EngineeringUniversity of Engineering and Technology TaxilaChakwalPakistan

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