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Electrical Conductivity and Mechanical Properties of Dendritic Copper Particulate Polymer Films

  • B. Shivamurthy
  • B. H. S. ThimmappaEmail author
  • Rohan Purushothama
  • G. K. V. D. Datta Sai
Regular Paper
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Abstract

Hybrid filler loaded multi-layer polymer composites are becoming one of the suitable alternative material for electromagnetic interference shielding (EMIS) applications. Mainly these composites are manufactured by conductive/magnetic fabrics, foams, foils or films or a combination of all, layered in an orderly architecture to obtain effective EMIS. In this work, dendrite structured copper particulate dispersed in cellulose acetate polymer (CA). We have developed approximately 100-micron thickness of cellulose acetate/copper filler (CA/Cu) films (7–55 wt%) and a neat CA film. The electrical conductivity, tensile strength, percentage of elongation, burst strength and folding endurance of CA/Cu films were measured and compared. The percolation threshold for conductivity was found at 28 wt% and the drastic increase in conductivity at 28–37 wt%. The mechanical strength of CA/Cu composite films was investigated and reported.

Keywords

Mechanical properties Electrical conductivity Particulate polymer films 

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Copyright information

© The Korean Institute of Electrical and Electronic Material Engineers 2018

Authors and Affiliations

  • B. Shivamurthy
    • 1
  • B. H. S. Thimmappa
    • 2
    Email author
  • Rohan Purushothama
    • 1
  • G. K. V. D. Datta Sai
    • 1
  1. 1.Department of Mechanical and Manufacturing Engineering, Manipal Institute of TechnologyManipal Academy of Higher EducationManipalIndia
  2. 2.Department of Chemistry, Manipal Institute of TechnologyManipal Academy of Higher EducationManipalIndia

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