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Copper nanomaterials and assemblies for soft electronics

  • Yang Feng (冯阳)
  • Jian Zhu (朱剑)Email author
Reviews SPECIAL ISSUE: Celebrating the 100th Anniversary of Nankai University
  • 73 Downloads

Abstract

Soft electronics that can simultaneously offer electronic functions and the capability to be deformed into arbitrary shapes are becoming increasingly important for wearable and bio-implanted applications. The past decade has witnessed tremendous progress in this field with a myriad of achievements in the preparation of soft electronic conductors, semiconductors, and dielectrics. Among these materials, copper-based soft electronic materials have attracted considerable attention for their use in flexible or stretchable electrodes or interconnecting circuits due to their low cost and abundance with excellent optical, electrical and mechanical properties. In this review, we summarize the recent progress on these materials with the detailed discussions of the synthesis of copper nanomaterials, approaches for their assemblies, strategies to resist the ambient corrosion, and their applications in various fields including flexible electrodes, sensors, and other soft devices. We conclude our discussions with perspectives on the remaining challenges to make copper soft conductors available for more widespread applications.

Keywords

copper nanomaterials assemblies composites stretchable conductors soft electronics 

基于铜纳米材料及其组装的柔性电子技术

摘要

柔性电子在可穿戴和生物植入等应用中发挥着越来越重要的作用. 柔性电子在实现一定电子功能的同时, 具备变形成任意形状的能力. 该领域在过去的十年里进展显著, 在柔性导体、半导体、 介电材料的制备中成果颇多. 在这些材料中, 铜基柔性导体由于其价格低廉, 地球储量丰富, 光、 电、 机械性能优异, 在柔性、 可拉伸电极或者电路互连中有着广阔的应用前景. 在这篇综述中, 我们总结了这些材料的最新进展, 详细讨论了铜纳米材料的合成、 组装、抗氧化腐蚀策略以及它们在各个领域的应用(如柔性电极、 传感器和其他柔性器件). 最后, 我们讨论了铜基柔性导体为应对更广泛的应用场景仍需面临的一系列挑战.

Notes

Acknowledgements

This work was supported by the National Natural Science Foundation of China (51873088), Tianjin Municipal Science and Technology Commission (18JCZDJC38400) in China, and “the Fundamental Research Funds for the Central Universities”, Nankai University (023/63191303).

Supplementary material

40843_2019_9468_MOESM1_ESM.pdf (1.7 mb)
Copper nanomaterials and assemblies for soft electronics

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Copyright information

© Science China Press and Springer-Verlag GmbH Germany, part of Springer Nature 2019

Authors and Affiliations

  1. 1.School of Materials Science and EngineeringNankai UniversityTianjinChina
  2. 2.National Institute for Advanced MaterialsNankai UniversityTianjinChina
  3. 3.Tianjin Key Laboratory of Metal and Molecule-Based Material ChemistryNankai UniversityTianjinChina
  4. 4.Tianjin Key Laboratory for Rare Earth Materials and ApplicationsNankai UniversityTianjinChina

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