Study of Profile Changes during Mechanical Polishing using Relocation Profilometry

  • S. Chidambara Kumaran
  • M. S. ShunmugamEmail author
Original Contribution


Mechanical polishing is a finishing process practiced conventionally to enhance quality of surface. Surface finish is improved by mechanical cutting action of abrasive particles on work surface. Polishing is complex in nature and research efforts have been focused on understanding the polishing mechanism. Study of changes in profile is a useful method of understanding behavior of the polishing process. Such a study requires tracing same profile at regular process intervals, which is a tedious job. An innovative relocation technique is followed in the present work to study profile changes during mechanical polishing of austenitic stainless steel specimen. Using special locating fixture, micro-indentation mark and cross-correlation technique, the same profile is traced at certain process intervals. Comparison of different parameters of profiles shows the manner in which metal removal takes place in the polishing process. Mass removal during process estimated by the same relocation technique is checked with that obtained using weight measurement. The proposed approach can be extended to other micro/nano finishing processes and favorable process conditions can be identified.


Mechanical polishing Relocation profilometry Profile changes Surface roughness Mass removal 



Authors are thankful to the sponsoring agencies DST (Grant No. SR/S3/MERC-68/2004 dated 08-06-2007) and IIT Madras (Grant No. MEE/03-04/181/IDRP/OVKC dated 01-10-2003) for providing the measurement facilities, at the Manufacturing Engineering Section, necessary to carry out the present investigation.


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Copyright information

© The Institution of Engineers (India) 2017

Authors and Affiliations

  1. 1.Department of Mechanical EngineeringIndian Institute of Technology MadrasChennaiIndia

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