Structure and Atomic Profile of Grain Boundary Triple Junctions in Tungsten
- 34 Downloads
The line of triple junction of the general type and special non-CSL grain boundaries was investigated by field ion microscope in high-textured tungsten. Using the controlled field evaporation, the spatial profiles of triple junctions were reconstructed. Atomic-scale wandering of the triple junction line was revealed. The lines of triple junctions of both types of grain boundaries are not perfectly smooth on the atomic scale and have a spatially oscillating character. The triple junction lines consist of the set of kinks with different heights. It was shown that every kink is caused by the existence of the microscopic twist stacking fault on triple junction line. The local penetration of some atomic layers of one crystal in another on grain boundaries within triple junctions was revealed.
KeywordsPolycrystal Grain boundaries Triple junctions Field ion microscope Tungsten
The authors are grateful for funding support from the National Academy of Science of Ukraine (Grant No. 32-08-14/1).
ES and IM assigned the tasks and planned the investigations. VK and IS fulfilled the FIM study and processed the experimental evidence. All authors analyzed the results and participated in the preparation of the manuscript. All authors read and approved the final manuscript.
Compliance with Ethical Standards
Conflict of interest
The authors declare that they have no conflict of interest.
- 7.E.V. Sadanov, I.V. Starchenko, I.M. Mikhailovski, Field ion microscopy of grain boundaries in high-textured tungsten, in Microscopy and Imaging Science: Practical Approaches to Applied Research and Education, ed. by A. Méndez-Vilas (Formatex, Badajoz, 2017), pp. 420–423Google Scholar
- 8.I.M. Mikhajlovskij, E.V. Sadanov, Structure and orientational relations of triple junctions of grain boundaries in tungsten. Poverkhnost’: Fizika, Khimiya, Mekhanika 5, 119–123 (1990)Google Scholar
- 17.T.I. Mazilova, E.V. Sadanov, O.V. Dudka, V.A. Ksenofontov, I.V. Starchenko, O.A. Velicodnaya, Analytical model for intergrain expansion and cleavage: random grain boundaries. PAST 2(90), 17–20 (2014)Google Scholar