Metallography, Microstructure, and Analysis

, Volume 7, Issue 6, pp 755–760 | Cite as

Structure and Atomic Profile of Grain Boundary Triple Junctions in Tungsten

  • E. V. Sadanov
  • I. V. StarchenkoEmail author
  • V. A. Ksenofontov
  • I. M. Mikhailovskij
Technical Article


The line of triple junction of the general type and special non-CSL grain boundaries was investigated by field ion microscope in high-textured tungsten. Using the controlled field evaporation, the spatial profiles of triple junctions were reconstructed. Atomic-scale wandering of the triple junction line was revealed. The lines of triple junctions of both types of grain boundaries are not perfectly smooth on the atomic scale and have a spatially oscillating character. The triple junction lines consist of the set of kinks with different heights. It was shown that every kink is caused by the existence of the microscopic twist stacking fault on triple junction line. The local penetration of some atomic layers of one crystal in another on grain boundaries within triple junctions was revealed.


Polycrystal Grain boundaries Triple junctions Field ion microscope Tungsten 



The authors are grateful for funding support from the National Academy of Science of Ukraine (Grant No. 32-08-14/1).

Authors’ Contributions

ES and IM assigned the tasks and planned the investigations. VK and IS fulfilled the FIM study and processed the experimental evidence. All authors analyzed the results and participated in the preparation of the manuscript. All authors read and approved the final manuscript.

Compliance with Ethical Standards

Conflict of interest

The authors declare that they have no conflict of interest.


  1. 1.
    I. Adlakha, K.N. Solanki, Structural stability and energetics of grain boundary triple junctions in face centered cubic materials. Sci. Rep. 5, 8692 (2015)CrossRefGoogle Scholar
  2. 2.
    M. Upmanyu, D.J. Srolovitz, L.S. Shvindlerman, G. Gottstein, Molecular dynamics simulation of triple junction migration. Acta Mater. 50, 1405–1420 (2002)CrossRefGoogle Scholar
  3. 3.
    M. Upmanyu, D.J. Srolovitz, L.S. Shvindlerman, G. Gottstein, Triple junction mobility: a molecular dynamics study. Interface Sci. 7, 307–319 (1999)CrossRefGoogle Scholar
  4. 4.
    Q. Zhao, W. Jiang, D.J. Srolovitz, W. Bao, Triple junction drag effects during topological changes in the evolution of polycrystalline microstructures. Acta Mater. 128, 345–350 (2017)CrossRefGoogle Scholar
  5. 5.
    D. Mattissen, D.A. Molodov, L.S. Shvindlerman, G. Gottstein, Drag effect of triple junctions on grain boundary and grain growth kinetics in aluminium. Acta Mater. 53, 2049–2057 (2005)CrossRefGoogle Scholar
  6. 6.
    L. Priester, D.P. Yu, Triple junctions at the mesoscopic, microscopic and nanoscopic scales. Mater. Sci. Eng. A 118, 113–119 (1994)CrossRefGoogle Scholar
  7. 7.
    E.V. Sadanov, I.V. Starchenko, I.M. Mikhailovski, Field ion microscopy of grain boundaries in high-textured tungsten, in Microscopy and Imaging Science: Practical Approaches to Applied Research and Education, ed. by A. Méndez-Vilas (Formatex, Badajoz, 2017), pp. 420–423Google Scholar
  8. 8.
    I.M. Mikhajlovskij, E.V. Sadanov, Structure and orientational relations of triple junctions of grain boundaries in tungsten. Poverkhnost’: Fizika, Khimiya, Mekhanika 5, 119–123 (1990)Google Scholar
  9. 9.
    A.S. Lazarenko, I.M. Mikhailovskij, V.B. Rabukhin, O.A. Velikodnaya, Nanotopography and grain boundary migration in the vicinity of triple junctions. Acta Metall. Mater. 43(2), 639–643 (1995)CrossRefGoogle Scholar
  10. 10.
    T. Xu, M. Li, Size and shape of grain boundary network components and their atomic structures in polycrystalline nanoscale materials. J. Appl. Phys. 118, 164302 (2015)CrossRefGoogle Scholar
  11. 11.
    E.W. Muller, T.T. Tsong, Field Ion Microscopy (Principles and Application) (Elsevier, New York, 1969)CrossRefGoogle Scholar
  12. 12.
    P.H. Pumphrey, A plane matching theory of high angle grain boundary structure. Scr. Metall. 6(2), 107–114 (1972)CrossRefGoogle Scholar
  13. 13.
    B. Ralph, P.R. Howell, T.F. Page, The structure of grain boundaries. A model based on planar matching. Phys. Stat. Sol. B 55(2), 641–652 (1973)CrossRefGoogle Scholar
  14. 14.
    E.V. Sadanov, T.I. Mazilova, V.A. Ksenofontov, I.V. Starchenko, I.M. Mikhailowskij, Special non-CSL grain boundaries in tungsten: misorientation distribution and energetics. Mater. Lett. 145, 137–140 (2015)CrossRefGoogle Scholar
  15. 15.
    O.V. Dudka, V.A. Ksenofontov, E.V. Sadanov, I.V. Starchenko, T.I. Mazilova, I.M. Mikhailovskij, Special grain boundaries in Ultrafine-Grained Tungsten. Nanoscale Res. Lett. 11, 332 (2016)CrossRefGoogle Scholar
  16. 16.
    L. Priester, Grain Boundaries: From Theory to Engineering (Springer, Dordrecht, 2013)CrossRefGoogle Scholar
  17. 17.
    T.I. Mazilova, E.V. Sadanov, O.V. Dudka, V.A. Ksenofontov, I.V. Starchenko, O.A. Velicodnaya, Analytical model for intergrain expansion and cleavage: random grain boundaries. PAST 2(90), 17–20 (2014)Google Scholar

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© Springer Science+Business Media, LLC, part of Springer Nature and ASM International 2018

Authors and Affiliations

  1. 1.Department of Condensed Matter, National Science Center “Kharkov Institute of Physics and Technology”National Academy of Sciences of UkraineKharkivUkraine

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