Advertisement

Electrochemical Surface Modification of Aluminum Sheets Prepared by Powder Metallurgy and Casting Techniques for Printed Circuit Applications

  • Hossam M. Yehia
  • Omayma A. Elkady
  • Y. Reda
  • K. E. Ashraf
Technical Paper
  • 23 Downloads

Abstract

Two series of Al sheets are coated with different thicknesses of copper-deposited film from 10 to 40 µm by the electroplating technique. The first group is the fresh cast Al sheets, and the other is the recycled water-atomized Al powder prepared by the technique of powder metallurgy. Microstructure and phase structure were examined by XRD, optical microscopy and FESEM. Electrical conductivity, thermal conductivity and coefficient of thermal expansion (CTE) were investigated. The XRD showed that only Al and Cu peaks appeared for the cast Al sheet samples, but for the recycled ones other peaks corresponding to Al2O3 were also detected. The microstructure indicated that the coated Cu layer had a dendritic structure in a continuous pattern, but for the recycled samples the dendritic structure was not clear but continuous. Both the thermal and electrical conductivities were gradually increased along with the increase in the Cu thickness, while the CTE was decreased.

Keywords

Electroplating Aluminum Copper deposition Sodium potassium tartrate Coefficient of thermal expansion (CTE) Water atomization, Aluminum circuit board 

Notes

Acknowledgements

The authors wish to thank the researchers and the technicians of the Central Metallurgical R&D Institute (CMRDI) in Helwan, Faculty of Industrial Education—Helwan University, Cairo, Egypt—and CAMC for their cooperation.

References

  1. 1.
  2. 2.
    Chawla L S, and Gupta R K, Material Selection for Corrosion Control Second Printing 1994. ASM International, Material Park (1994).Google Scholar
  3. 3.
    Tanwir A, and Akhter A, Int J Adv Technol Eng Sci 5 (2017) 278.Google Scholar
  4. 4.
    Davis J R, Alloying: Understanding the Basics, ASM International, Material Park (2001) p 351.Google Scholar
  5. 5.
    Peterson R K, Mowatt L J, Poteet A D, and Johnson T K, Advanced Polymers on Metal Printed WRNG Board, Patent No. 4,963,697 (1990).Google Scholar
  6. 6.
    Vojtĕch D, Metalurgia 49 (2010) 181.Google Scholar
  7. 7.
    Moona G, Walia R S, Rastogi V, and Sharma R, Indian J Pure Appl Phys 56 (2018) 164.Google Scholar
  8. 8.
    Fuziana Y F, Rashid A R M, Lajis M A, and Muhammad N S, Mater Res Innov 18 (2014) 354.CrossRefGoogle Scholar
  9. 9.
    Itlale S, and Bapat S, Res J Eng Technol 3 (2016) 1022.Google Scholar
  10. 10.
    Konecn R, and Fintov S, Performance-Enhancing Processes, Intech, New York (2012) p 4.Google Scholar
  11. 11.
    Yehia H M, El-Kady O, and Abu-Oqail A, J Refract Metals Hard Mater 71 (2018) 198.CrossRefGoogle Scholar
  12. 12.
    Fleury V, Watters W A, Allam L, and Devers T, Lett Nat 416 (2002) 716.CrossRefGoogle Scholar
  13. 13.
    Ait J H, Liu S P, Widharta N A, Adhikari S, Anderegg J W, and Hebert K R, J Phys Chem 115 (2011) 22354. https://digital.library.unt.edu/search/?q4=%22Sandia%20National%20Laboratories%22&t4=dc_publisher&src=ark&searchType=advanced.
  14. 14.
    Bhattacharyya A S, Raj S K, Kommu P, Prabhakar P, Kumar R P, Kumari N, and Gaurav K, Surf Interface Anal 48 (2016) 1294.CrossRefGoogle Scholar
  15. 15.
    Du S, and Yongtang L, Adv Mater Sci Eng 969580 (2015) 1.Google Scholar
  16. 16.
    Ismail A S, Egypt J Pet 26 (2017) 61.CrossRefGoogle Scholar
  17. 17.
    Wei C, Wu G, Yang S, and Liu Q, Sci Rep 6 (2016) 1.CrossRefGoogle Scholar
  18. 18.
    Thirumavalavan S, Mani K, and Sagadevan S, Mater Res 18 (2015) 1000.CrossRefGoogle Scholar
  19. 19.
    Zhou X J, Harmer A J, Heinig N F, and Leung K T, Langmuir 20 (2004) 5109.CrossRefGoogle Scholar
  20. 20.
    Le N, Phan T C, Le A D, Dang T M, and Dang M C, Adv Nat Sci 6 (2015) 1.Google Scholar
  21. 21.
    El-Kady O, and Fathy A, Mater Des 54 (2014) 348.CrossRefGoogle Scholar
  22. 22.
    Abolkassem S A, Elkady O A, Elsayed A H, Hussein W A, and Yehya H M, Res Phys 9 (2018) 1102.Google Scholar
  23. 23.
    Tsutsui T, Hitachi Chem Tech Rep 12 (2012) 12.Google Scholar
  24. 24.
    Hakamada M, Kuromura T, Chen Y, Kusuda H, and Mabuchi M, Mater Trans 48 (2007) 32.CrossRefGoogle Scholar
  25. 25.
    Montes J M, Cuevas F G, Ternero F, Astacio R, Caballero E S, and Cintas J, Metals 7 (2017) 1.CrossRefGoogle Scholar

Copyright information

© The Indian Institute of Metals - IIM 2018

Authors and Affiliations

  1. 1.Production Technology, Faculty of Industrial EducationHelwan UniversityCairoEgypt
  2. 2.Powder Technology Division, Manufacturing DepartmentCentral Metallurgical R&D Institute (CMRDI)P. O. BOX 87 Helwan, 11421 CairoEgypt
  3. 3.Chemical Engineering DepartmentHigher Institute of Engineering and TechnologyNew DamiatteEgypt
  4. 4.Lap of NanotechnologyElectronic Research InstituteDokki, CairoEgypt

Personalised recommendations