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In situ backscattered electron imaging study of the effect of annealing on the deformation behaviors of Ni electroformed from additive-free and saccharin-containing sulfamate solutions

  • Kai Jiang
  • Hiroaki Nakano
  • Satoshi Oue
  • Tatsuya Morikawa
  • Wen-huai TianEmail author
Article
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Abstract

The Ni samples were electroformed from additive-free (AF) and saccharin-containing (SC) sulfamate solutions, respectively. In situ backscattered electron (BSE) imaging, electron backscatter diffraction (EBSD), and electron-probe microanalysis (EPMA) were used to investigate the effect of annealing on the deformation behaviors of the AF and SC samples. The results indicate that columnar grains of the as-deposited AF sample had an approximated average width of 3 μm and an approximated aspect ratio of 8. The average width of columnar grains of the as-deposited SC sample was reduced to approximately 400 nm by the addition of saccharin to the electrolyte. A few very-large grains distributed in the matrix of the SC sample after annealing. No direct evidence indicated that S segregated at the grain boundaries before or after annealing. The average value of the total elongations of the SC samples decreased from 16% to 6% after annealing, whereas that of the AF samples increased from 18% to 50%. The dislocation recovery in grain-boundary areas of the annealed AF sample was reduced, which contributed to the appearance of microvoids at the triple junctions. The incompatibility deformation between very-large grains and fine grains contributed to the brittle fracture behavior of the annealed SC Ni.

Keywords

backscattered electron imaging annealing electroformed Ni sulfamate solution deformation behaviors 

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Notes

Acknowledgements

This work was financially supported by the China Scholarship Council (No. 201606460015). The authors also appreciate the support of the H. Nakano laboratory of Kyushu University for the study.

References

  1. [1]
    E. Galante, A. Haddad, and N. Marques, Application of explosives in the oil industry, Int. J. Oil Gas Coal Eng., 1(2013), No. 2, p. 16.CrossRefGoogle Scholar
  2. [2]
    G. Birkhoff, D.P. Macdougall, E.M. Pugh, and S.G. Taylor, Explosives with lined cavities, J. Appl. Phys., 19(1948), No. 6, p. 563.CrossRefGoogle Scholar
  3. [3]
    A. Robertson, U. Erb, and G. Palumbo, Practical applications for electrodeposited nanocrystalline materials, Nanostruct. Mater., 12(1999), No. 5, p. 1035.CrossRefGoogle Scholar
  4. [4]
    G.R. Yang, C.P. Huang, W.M. Song, J. Li, J.J. Lu, Y. Ma, and Y. Hao, Microstructure characteristics of Ni/WC composite cladding coatings, Int. J. Miner. Metall. Mater., 23(2016), No. 2, p. 184.CrossRefGoogle Scholar
  5. [5]
    J.X. Wang, G.X. Wang, J.S. Liu, L.Y. Zhang, W. Wang, Z. Li, Q.X. Wang, and J.F. Sun, Microstructure of Ni-Al powder and Ni-Al composite coatings prepared by twin-wire arc spraying, Int. J. Miner. Metall. Mater., 23(2016), No. 7, p. 810.CrossRefGoogle Scholar
  6. [6]
    G.J. Chen, J.M. Gao, M. Zhang, and M. Guo, Efficient and selective recovery of Ni, Cu, and Co from low-nickel matte via a hydrometallurgical process, Int. J. Miner. Metall. Mater., 24(2017), No. 3, p. 249.CrossRefGoogle Scholar
  7. [7]
    M. Prasad and A.H. Chokshi, Superplasticity in electrodeposited nanocrystalline nickel, Acta Mater., 58(2010), No. 17, p. 5724.CrossRefGoogle Scholar
  8. [8]
    M. Prasad and A.H. Chokshi, Extraordinary high strain rate superplasticity in electrodeposited nano-nickel and alloys, Scripta Mater., 63(2010), No. 1, p. 136.CrossRefGoogle Scholar
  9. [9]
    W.H. Yang, Y. Luo, C.Y. Wang, B.G. Wang, and W.T. Tian, High plasticity and anodic behavior of electroformed nickel without chloride ion, Mater. Des., 93(2016), p. 91.CrossRefGoogle Scholar
  10. [10]
    F. Yang, W.T. Tian, C.C. Feng, and B.S. Wang, Crystal defects formed in electroformed nickel liners of shaped charges, Acta Metall. Sin., 22(2009), No. 5, p. 383.CrossRefGoogle Scholar
  11. [11]
    F. Yang, C.H. Li, S.W. Cheng, L. Wang, and W.T. Tian, Deformation behavior of explosive detonation in electroformed nickel liner of shaped charge with nano-sized grains, Trans. Nonferrous Met. Soc. China, 20(2010), No. 8, p. 1397.CrossRefGoogle Scholar
  12. [12]
    F. Yang, W. Tian, H. Nakano, H. Tsuji, S. Oue, and H. Fukushima, Effect of current density and organic additives on the texture and hardness of Ni electrodeposited from sulfamate and Watt’s solutions, Mater. Trans., 51(2010), No. 5, p. 948.CrossRefGoogle Scholar
  13. [13]
    H. Nakano, H. Tsuji, S. Oue, H. Fukushima, F. Yang, and W. Tian, Effect of organic additives on the hardness of Ni electrodeposited from sulfamate and Watt’s solutions, Mater. Trans., 52(2011), No. 11, p. 2077.CrossRefGoogle Scholar
  14. [14]
    Y.M. Wang, S. Cheng, Q.M. Wei, E. Ma, T.G. Nieh, and A. Hamza, Effects of annealing and impurities on tensile properties of electrodeposited nanocrystalline Ni, Scripta Mater., 51(2004), No. 11, p. 1023.CrossRefGoogle Scholar
  15. [15]
    M. Yamaguchi, M. Shiga, and H. Kaburaki, Grain boundary decohesion by impurity segregation in a nickel-sulfur system, Science, 307(2005), No. 5708, p. 393.CrossRefGoogle Scholar
  16. [16]
    J.K. Heuer, P.R. Okamoto, N.Q. Lam, and J.F. Stubbins, Relationship between segregation-induced intergranular fracture and melting in the nickel-sulfur system, Appl. Phys. Lett., 76(2000), No. 23, p. 3403.CrossRefGoogle Scholar
  17. [17]
    S. Mahalingam, P. Flewitt, and J.F. Knott, The ductile-brittle transition for nominally pure polycrystalline nickel, Mater. Sci. Eng. A, 564(2013), No. 3, p. 342.CrossRefGoogle Scholar
  18. [18]
    C. Kwan, Z. Li, and Z. Wang, Progression of late stage abnormal grain growth of electroformed nanocrystalline Ni without the addition of grain refiner, Metall. Mater. Trans. A, 46(2015), No. 10, p. 4636.CrossRefGoogle Scholar
  19. [19]
    L. Margulies, G. Winther, and H.F. Poulsen, In situ measurement of grain rotation during deformation of polycrystals, Science, 291(2001), No. 5512, p. 2392.CrossRefGoogle Scholar
  20. [20]
    P. Chen, S.C. Mao, Y. Liu, F. Wang, Y.F. Zhang, Z. Zhang, and X.D. Han, In-situ EBSD study of the active slip systems and lattice rotation behavior of surface grains in aluminum alloy during tensile deformation, Mater. Sci. Eng. A, 580(2013), No. 10, p. 114.CrossRefGoogle Scholar
  21. [21]
    S. Zaefferer and N. Elhami, Theory and application of electron channelling contrast imaging under controlled diffraction conditions, Acta Mater., 75(2014), No. 16, p. 20.CrossRefGoogle Scholar
  22. [22]
    I. Gutierrez-Urrutia and D. Raabe, Multistage strain hardening through dislocation substructure and twinning in a high strength and ductile weight-reduced Fe-Mn-Al-C steel, Acta Mater., 60(2012), No. 16, p. 5791.CrossRefGoogle Scholar
  23. [23]
    J.E. Darnbrough and P. Flewitt, Growth of abnormal planar faceted grains in nanocrystalline nickel containing impurity sulphur, Acta Mater., 79(2014), No. 30, p. 421.CrossRefGoogle Scholar
  24. [24]
    P. Cizek, A. Sankaran, E.F. Rauch, and M.R. Barnett, Microstructure and texture of electrodeposited nanocrystalline nickel in the as-deposited state and after in-situ and ex-situ annealing, Metall. Mater. Trans. A, 47(2016), No. 12, p. 6655.CrossRefGoogle Scholar
  25. [25]
    Z.S. You, L. Lu, and K. Lu, Tensile behavior of columnar grained Cu with preferentially oriented nanoscale twins, Acta Mater., 59(2011), No. 18, p. 6927.CrossRefGoogle Scholar

Copyright information

© University of Science and Technology Beijing and Springer-Verlag GmbH Germany, part of Springer Nature 2019

Authors and Affiliations

  • Kai Jiang
    • 1
  • Hiroaki Nakano
    • 2
  • Satoshi Oue
    • 2
  • Tatsuya Morikawa
    • 2
  • Wen-huai Tian
    • 1
    Email author
  1. 1.School of Materials Science and EngineeringUniversity of Science and Technology BeijingBeijingChina
  2. 2.Faculty of EngineeringKyushu UniversityFukuokaJapan

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