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Rare Metals

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Enhancement of magnetic properties of hot pressed/die-upset Dy-free Nd–Fe–B magnets with Cu/Nd coating by wet process

  • Jeehye Kwon
  • Dajeong Lee
  • Dayoung Yoo
  • Seongkyu Park
  • Hee-Ryoung Cha
  • Hae-Woong Kwon
  • Junggoo Lee
  • Dongyun LeeEmail author
Article

Abstract

A grain boundary diffusion process (GBDP) was adopted to improve magnetic properties of Dy-free highly coercive Nd–Fe–B permanent magnet by coating thin layers of Nd and Cu in grain boundaries. For GBDP of Nd and Cu, Nd and Cu were coated by wet process, e.g., electrochemical and electroless on Nd–Fe–B magnets, which was fabricated by hot-deformed/die-upset with melt-spun specimen. Heat treatment was performed for 20 min at 600 °C followed by several different cooling conditions. The cooling conditions after heat treatment were varied to understand distribution and microstructural effects of Nd and Cu species in grain boundaries. The coercivity increased from 1.565 to 1.637 T in oil cooling rate but remanence decreased, while remanence jumped with little decrease in coercivity in furnace cooling. Microstructure analyses suggested that the coercivity was closely related to the cooling rate as well as distribution of Nd. The mechanism of coercivity enhancement due to the cooling rate was discussed based on the results presented here and those in the literature.

Keywords

Magnetic materials Electrochemical deposition Diffusion Scanning electron microscopy Coercivity 

Notes

Acknowledgements

This research was financially supported by the National Research Foundation of Korea (No. 2015R1A2A2A01 002795), the Fundamental R&D Program for Core Technology of Materials funded by the Ministry of Trade, Industry, and Energy, Republic of Korea (No. 10080382) and the Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (No. 2018R1D1A1B07041358).

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Copyright information

© The Nonferrous Metals Society of China and Springer-Verlag GmbH Germany, part of Springer Nature 2019

Authors and Affiliations

  1. 1.Department of Advanced Circuit InterconnectionPusan National UniversityBusanRepublic of Korea
  2. 2.Department of Nano Fusion TechnologyPusan National UniversityBusanRepublic of Korea
  3. 3.Powder and Ceramics DepartmentKorea Institute of Machinery and MaterialsChangwonRepublic of Korea
  4. 4.Department of Materials Science and EngineeringPukyong National UniversityBusanRepublic of Korea
  5. 5.Department of Nanoenergy EngineeringPusan National UniversityBusanRepublic of Korea

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