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Metals and Materials International

, Volume 25, Issue 5, pp 1388–1393 | Cite as

Low-Temperature Sintering Characteristics of Ag-Based Complex Inks Using Transient Melting and Joining of Sn–58Bi Nanoparticles

  • Woo Lim Choi
  • Jong-Hyun LeeEmail author
Article
  • 35 Downloads

Abstract

A novel complex ink was fabricated by mixing Sn–58Bi nanoparticles with a commercial conductive ink containing Ag nanoparticles and then sintered rapidly for 110 s at 140 °C in air using a conveyor-type reflow furnace. Sn–58Bi nanoparticles smaller than 15 nm wetted on the neighboring Ag nanoparticles immediately after melting at temperatures lower than their melting point, and hence, acted as transient liquid-phase binders. The composite film sintered with 4 wt% Sn–58Bi exhibited stability and a low electrical resistivity of 4.46 μΩ cm, and hence, was found to be compatible with low-cost flexible films.

Graphical Abstract

Keywords

Sintering Electrical resistivity Thin films Nanostructure Complex ink 

Notes

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Copyright information

© The Korean Institute of Metals and Materials 2019

Authors and Affiliations

  1. 1.Department of Materials Science and EngineeringSeoul National University of Science and TechnologySeoulRepublic of Korea

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