Metals and Materials International

, Volume 25, Issue 3, pp 821–821 | Cite as

Correction to: Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer

  • Seok-Bon Koo
  • Chang-Myeon Lee
  • Sang-Jun Kwon
  • Jun-Mi Jeon
  • Jin-young Hur
  • Hong-Kee LeeEmail author

1 Correction to: Metals and Materials International (2019) 25:117–126

Unfortunately, the acknowledgements were missing in the original version of this article. The information is given below:

Acknowledgements This work was supported by the Advanced Technology Center Program funded By the Ministry of Trade, Industry and Energy (11051962) and the Technology Development Program to Solve Climate Changes of the National Research Foundation (NRF) funded by the Ministry of Science, ICT & Future Planning (NRF-2018M1A2A2063336).

Copyright information

© The Korean Institute of Metals and Materials 2019

Authors and Affiliations

  1. 1.Surface Technology R&D GroupKorea Institute of Industrial TechnologyIncheonRepublic of Korea
  2. 2.Advanced Analysis CenterKorea Institute of Science and TechnologySeoulRepublic of Korea

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