Correction to: Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer
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1 Correction to: Metals and Materials International (2019) 25:117–126 https://doi.org/10.1007/s12540-018-0167-7
Unfortunately, the acknowledgements were missing in the original version of this article. The information is given below:
Acknowledgements This work was supported by the Advanced Technology Center Program funded By the Ministry of Trade, Industry and Energy (11051962) and the Technology Development Program to Solve Climate Changes of the National Research Foundation (NRF) funded by the Ministry of Science, ICT & Future Planning (NRF-2018M1A2A2063336).