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Journal of Mechanical Science and Technology

, Volume 33, Issue 11, pp 5375–5382 | Cite as

High-frequency induction heating for increase of flow length in polymer/metal hybrid molding

  • Hyun-Joong Lee
  • Nam-Hoon Jang
  • Keun ParkEmail author
Article
  • 2 Downloads

Abstract

Recent trends of miniaturization and multi-functionality in electrical parts have driven development of molded interconnect devices (MIDs) that contain conductive tracks on a nonconductive base. This study aims to develop polymer/metal hybrid molding technology to fabricate MIDs in a single manufacturing process, without an additional assembly procedure. For this purpose, injection molding was performed to fabricate a thermoplastic carrier that contained negative circuit channels, and die casting was used to fill the circuit channels with metal alloy of low melting point. To increase the flow length of the molten metal through the narrow circuit channel, high-frequency induction heating was used prior to the die casting stage. The effect of heating conditions on the mold temperature was investigated numerically, and the relevant induction heating conditions were determined accordingly. Induction heating was then applied to the die casting process to increase the flow length enough to be used as a circuit path for fabrication of MIDs.

Keywords

Injection molding Die casting Multi-component molding Molded interconnect device Induction heating 

Nomenclature

r

Radius of the point P(x, y)

p

Pitch distance between the adjacent spiral curve

θ

Winding angle of the point P(x, y) in a spiral curve

α

Apparent angle of the point P(x, y) in a spiral curve

μ

Magnetic permeability of the mold material

σ

Electrical resistivity of the mold material

k

Thermal conductivity of the mold material

ρ

Density of the mold material

C

Specific heat of the mold material

A

Magnetic vector potential

J

Current density of the induced eddy current

Q

Joule heat

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Notes

Acknowledgments

This study was supported by a grant from the Technology Innovation Program (Grant no: 10077472) funded by the Ministry of Trade, Industry & Energy (MOTIE, Korea). The authors also thank to Mr. Dong-In Jang at HIGHT TECH SYS Co. Ltd. for his support with the die casting experiments.

References

  1. [1]
    A. Islam, H. N. Hansen and N. Giannekas, Quality investigation of miniaturized moulded interconnect devices (MIDs) for hearing aid applications, CIRP Annl. Manuf. Technol., 64 (1) (2015) 539–544.CrossRefGoogle Scholar
  2. [2]
    P. Khuntontong, T. Blaser and W. K. Schomburg, Fabrication of molded interconnection devices by ultrasonic hot embossing on thin polymer films, IEEE Trans. Electron. Packag. Manuf., 32 (3) (2009) 152–156.CrossRefGoogle Scholar
  3. [3]
    A. Islam, H. N. Hansen, P. T. Tang and J. Sun, Process chains for the manufacturing of molded interconnect devices, Int. J. Adv. Manuf. Technol., 42 (9-10) (2009) 831–841.CrossRefGoogle Scholar
  4. [4]
    J. Y. Chen and Y. B. Young, Two-component injection molding of molded interconnect devices, Int. J. Mater. Sci., 3 (3) (2013) 90–96.Google Scholar
  5. [5]
    J. Lee, H. C. Kim, J. W. Choi and I. H. Lee, A review on 3D printed smart devices for 4D printing, Int. J. Precis. Eng. Manuf. Green Technol., 4 (3) (2017) 377–383.Google Scholar
  6. [6]
    J. J. Adams, E. B. Duoss, T. F. Malkowski, M. J. Motala, B. Y. Ahn, R. G. Nuzzo, J. T. Bernhard and J. A. Lewis, Conformal printing of electrically small antennas on three-dimensional surfaces, Adv. Mater., 23 (11) (2011) 1335–1340.CrossRefGoogle Scholar
  7. [7]
    A. Lopes, E. MacDonald and R. B. Wicker, Integrating stereolithography and direct print technologies for 3D structural electronics fabrication, Rapid Prototyp. J., 18 (2) (2012) 129–143.CrossRefGoogle Scholar
  8. [8]
    D. Espalin, D. W. E. Muse, E. MacDonald and R. B. Wicker, 3D printing multifunctionality: Structures with electronics, Int. J. Adv. Manuf. Technol., 72 (5-8) (2014) 963–978.CrossRefGoogle Scholar
  9. [9]
    Y. Lu, H. Y. Yun, M. Vatani, H. C. Kim and J. W. Choi, Direct-print/cure as a molded interconnect device (MID) process for fabrication of automobile cruise controllers, J. Mech. Sci. Technol., 29 (12) (2015) 5377–5385.CrossRefGoogle Scholar
  10. [10]
    W. Michaeli, C. Hopmann, J. Fragner and T. Pfefferkorn, Injection molding of conductor paths: Integration of functionality by the use of a metal/thermoplastic hybrid material, J. Polym. Eng., 31 (6-7) (2011) 479–487.CrossRefGoogle Scholar
  11. [11]
    C. Hopmann, K. Bobzin, R. Schoeldgen, M. Oete, J. Wunderle, T. F. Linke and P. Ochotta, Injection molding of conductor paths: integration of functionality by the use of a metal/thermoplastic hybrid material, J. Polym. Eng., 36 (6) (2016) 549–556.CrossRefGoogle Scholar
  12. [12]
    D. H. Kim, M. H. Kang and Y. H. Chun, Development of a new injection molding technology: Momentary mold surface heating process, J. Injection Molding Technol., 5 (4) (2001) 229–232.Google Scholar
  13. [13]
    P. C. Chang and S. J. Hwang, Experimental investigation of infrared rapid surface heating for injection molding, J. Appl. Polym. Sci., 102 (4) (2006) 3704–3713.CrossRefGoogle Scholar
  14. [14]
    H. J, Lee, D. J. Shin and K. Park, Ultrasonic thermoform-ing of a large thermoplastic polyurethane film with the aid of infrared heating, J. Mech. Sci. Tech., 31 (12) (2017) 5687–5693.CrossRefGoogle Scholar
  15. [15]
    M. C. Jeng, S. C. Chen, P. S. Minh, J. A. Chang and C. S. Chung, Rapid mold temperature control in injection molding by using steam heating, Int. Commun. Heat Mass Transf., 37 (9) (2010) 1295–1304.CrossRefGoogle Scholar
  16. [16]
    G. Wang, G. Zhao, H. Li and Y. Guan, Research of thermal response simulation and mold structure optimization for rapid heat cycle molding processes, respectively, with steam heating and electric heating, Mater. Design, 31 (1) (2010) 382–395.CrossRefGoogle Scholar
  17. [17]
    D. Yao and B. Kim, Increasing flow length in thin wall injection molding using a rapidly heated mold, Polym. Plast. Tech. Eng., 41 (5) (2002) 819–832.CrossRefGoogle Scholar
  18. [18]
    K. Park, B. Kim and D. Yao, Numerical simulation for injection molding with a rapidly heated mold, Part I: Flow simulation for thin wall parts, Polym. Plast. Tech. Eng., 45 (8) (2006) 897–902.CrossRefGoogle Scholar
  19. [19]
    K. Park, B. Kim and D. Yao, Numerical simulation for injection molding with a rapidly heated mold, Part II: Birefringence prediction, Polym. Plast. Tech. Eng., 45 (8) (2006) 903–909.CrossRefGoogle Scholar
  20. [20]
    S. C. Chen, W. R. Jong and J. A. Chang, Dynamic mold surface temperature control using induction heating and its effects on the surface appearance on weld line, J. Appl. Polym. Sci., 101 (2006) 1174–1180.CrossRefGoogle Scholar
  21. [21]
    O. K. Kwon, H. T. Jeong. J. H. Yoon and K. Park, A study on rapid mold heating system using high-frequency induction heating, Trans. Kor. Soc. Mech. Engng. A, 31 (5) (2007) 594–600.CrossRefGoogle Scholar
  22. [22]
    K. Park, D. H. Sohn and K. H. Cho, Eliminating weldlines of an injection molded part with the aid of high-frequency induction heating, J. Mech. Sci. Tech., 24 (1) (2010) 149–152.CrossRefGoogle Scholar
  23. [23]
    J. W. Jung, N. H. Chang, H. J. Lee and K. Park, A study on embedded heating structure for plastic-metal hybrid molding, Trans. Kor. Soc. Mech. Engng. A, 43 (2) (2019) 145–152.CrossRefGoogle Scholar
  24. [24]
    H. Eom and K. Park, Integrated numerical analysis to evaluate replication characteristics of micro channels in a locally heated mold by selective induction, Int. J. Precis. Eng. Manuf., 12 (1) (2011) 53–60.CrossRefGoogle Scholar
  25. [25]
    F. Li, X. Li, X. Qin and Y. K. Rong, Study on the plane induction heating process strengthened by magnetic flux concentrator based on response surface methodology, J. Mech. Sci. Technol., 32 (5) (2018) 2347–2356.CrossRefGoogle Scholar

Copyright information

© KSME & Springer 2019

Authors and Affiliations

  1. 1.Department of Mechanical System Design EngineeringSeoul National University Science and TechnologySeoulKorea
  2. 2.Precision Engineering TeamSamsung Electro-Mechanics Co.SuwonKorea

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