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Journal of Mechanical Science and Technology

, Volume 32, Issue 11, pp 5111–5119 | Cite as

Characterizing wafer stage transmission errors via binary decision diagram and dynamic fault tree

  • Junyu Guo
  • Guo-Zhong Fu
  • Hong-Zhong Huang
  • Yu Liu
  • Yan-Feng Li
Article
  • 5 Downloads

Abstract

The wafer stage, as a key subsystem of the dual-stage lithographic tool, possesses the characteristic of high moving accuracy. The fault tree analysis (FTA), which plays an important role in the design stage of the wafer stage, is performed to distinguish the critical events leading to the overall transmission error. However, in view of the complexity of the wafer stage’s structure and operation mechanism, the binary decision diagrams and dynamic fault tree analysis methods are implemented in this paper to obtain a simplified calculation process and a supplement with the dynamic characteristic respectively. This is not achieved by the traditional FTA method. The event “wafer stage’s repetitive error along X axis exceeds 5 nm” is viewed as the top event of the fault tree. In this paper, we identify the critical factors affecting the kinematic accuracy of the wafer stage.

Keywords

Wafer stage Kinematic accuracy Fault tree analysis Binary decision diagram Dynamic fault tree analysis 

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Copyright information

© The Korean Society of Mechanical Engineers and Springer-Verlag GmbH Germany, part of Springer Nature 2018

Authors and Affiliations

  • Junyu Guo
    • 1
    • 2
  • Guo-Zhong Fu
    • 2
  • Hong-Zhong Huang
    • 2
  • Yu Liu
    • 2
  • Yan-Feng Li
    • 2
  1. 1.School of Mechanical and Electrical EngineeringUniversity of Electronic Science and Technology of ChinaChengdu, SichuanChina
  2. 2.Center for System Reliability and SafetyUniversity of Electronic Science and Technology of ChinaChengdu, SichuanChina

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