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Micro-Grinding Performance of Hard-Brittle Chip Materials in Precision Micro-Grinding Microgroove

  • Long Zhang (张龙)
  • Jin Xie (谢晋)Email author
  • Limin Zhu (朱利民)
  • Yanjun Lu (鲁艳军)
Article

Abstract

The micro-structure on hard-brittle chip materials (HBCMs) surface can produce predominant functions and features. The micro-grinding with diamond wheel micro-tip is an efficient method to machine microstructure on HBCMs. However, different HBCMs and crystal orientation may have a significant influence on the micro-grinding performance. In this paper, the micro-grinding performance along different crystal orientation of HBCMs is investigated. First, a dressed 600# diamond grinding wheel is used to micro-grind micro-structure on HBCMs. Then, the experiment of micro-grinding force test is completed. Finally, the quality of microgroove, the grinding ratio and the micro-grinding force are investigated and they are related to the crystal orientation of HBCMs. It is shown that the stronger resistance to the micro-crack propagation has the best quality of microgroove and the smallest grinding ratio. Moreover, the hardest single-crystal SiC has the best machinability and the micro-grinding force is 38.9%, 10.8% and 46.8% less than the one of sapphire, single-crystal Si and quartz glass, respectively. The direction to micro-grind easily is the crystal orientation 〈10\(\overline 1 \)0〉 for single-crystal SiC and sapphire. In addition, the micro-grinding force increases with the increase of the micro-grinding depth and feed rate and decreases with the increase of the grinding wheel speed.

Key words

precision micro-grinding crystal orientation hard-brittle chip materials (HBCMs) 

CLC number

TH 16 

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Copyright information

© Shanghai Jiaotong University and Springer-Verlag GmbH Germany, part of Springer Nature 2018

Authors and Affiliations

  • Long Zhang (张龙)
    • 1
    • 2
  • Jin Xie (谢晋)
    • 2
    Email author
  • Limin Zhu (朱利民)
    • 1
  • Yanjun Lu (鲁艳军)
    • 3
  1. 1.State Key Laboratory of Mechanical System and Vibration, School of Mechanical EngineeringShanghai Jiao Tong UniversityShanghaiChina
  2. 2.School of Mechanical and Automotive EngineeringSouth China University of TechnologyGuangzhouChina
  3. 3.College of Mechatronics and Control EngineeringShenzhen UniversityShenzhen, GuangdongChina

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