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Microstructural Evolution and Mechanism of Grain Refinement During Annealing of Cold-Drawn Copper Clad Steel Wires

  • Hongjuan LiEmail author
  • Zhimin DingEmail author
  • Fengliang Tan
  • Baogang Liu
Advanced Characterization of Interfaces and Thin Films


Microstructural analysis of copper clad steel (CCS) wires was performed after annealing using electron backscattered diffraction and a transmission electron microscope. Precipitation at the Cu/Fe interfaces was investigated, and the grain refinement mechanism was discussed. The results showed that elongated grains of copper and steel were gradually transformed into equiaxed grains after annealing. The grain sizes were increased with enhancing annealing temperature. The grains of copper and steel near the Cu/Fe interfaces showed a finer grain size distribution than those away from the interfaces. The microstructures of both copper and steel affected the deformation and re-crystallization of grains and sub-grains under the cladding state condition. The deformed grains were gradually transformed into re-crystallized grains and sub-grains with increasing annealing temperature. A number of precipitated Cu and α-Fe phases, ranging from 10 nm to 60 nm, were located near the Cu/Fe interfaces of CCS wires at the annealing temperature of 8°C. Based on a rigorous microstructural investigation, the grain refinement mechanism could be attributed to the appearance of sub-grains and precipitated phases at the Cu/Fe interfaces of CCS wires.



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Copyright information

© The Minerals, Metals & Materials Society 2019

Authors and Affiliations

  1. 1.Department of Materials EngineeringHunan University of Humanities, Science and TechnologyLoudiPeople’s Republic of China
  2. 2.College of Materials Science and EngineeringDalian Jiao tong UniversityDalianPeople’s Republic of China

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