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JOM

, Volume 71, Issue 12, pp 4931–4939 | Cite as

Compression Brazing of SiCp/Al Composite Using a Semisolid Zn-Al-Cu Filler Metal Based on the Strain-Induced Melt Activation Process

  • Jing Xiao
  • Shun Li
  • Shuxin BaiEmail author
  • Jiuchun Yan
  • Degan Xiong
  • Yu Tang
Technical Article
  • 35 Downloads

Abstract

The compression brazing of SiCp/Al composite using a semisolid Zn-Al-Cu filler metal based on the strain-induced melt activation process was performed. The as-rolled filler metal was placed between pieces of SiCp/Al composite and heated to the semisolid temperature range for 20 min to spheroidize the solid grains of the filler. Subsequent compression caused the solid grains to compress and slide to the SiCp/Al composite surface. This disrupted the oxide film on the composite surface and promoted interdiffusion between the filler and SiCp/Al composite, forming a metallurgically bonded joint upon cooling. The optimum spherical microstructure of the filler metal was obtained at 392°C, resulting in intense solid grain sliding during compression among the samples considered in this study. A significant disruption of the oxide film was observed at 392°C, and the joint showed shear strength of 105 MPa, reaching 78% of that of the base materials.

Notes

Acknowledgements

This Project was supported by the National Natural Science Foundation of China (No. 51435004).

Conflict of interest

There is no conflict of interest regarding the publication of this paper.

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Copyright information

© The Minerals, Metals & Materials Society 2019

Authors and Affiliations

  • Jing Xiao
    • 1
  • Shun Li
    • 1
  • Shuxin Bai
    • 1
    Email author
  • Jiuchun Yan
    • 2
  • Degan Xiong
    • 1
  • Yu Tang
    • 1
  1. 1.College of Aerospace Science and EngineeringNational University of Defense TechnologyChangshaChina
  2. 2.State Key Laboratory of Advanced Welding and JoiningHarbin Institute of TechnologyHarbinChina

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