Compression Brazing of SiCp/Al Composite Using a Semisolid Zn-Al-Cu Filler Metal Based on the Strain-Induced Melt Activation Process
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The compression brazing of SiCp/Al composite using a semisolid Zn-Al-Cu filler metal based on the strain-induced melt activation process was performed. The as-rolled filler metal was placed between pieces of SiCp/Al composite and heated to the semisolid temperature range for 20 min to spheroidize the solid grains of the filler. Subsequent compression caused the solid grains to compress and slide to the SiCp/Al composite surface. This disrupted the oxide film on the composite surface and promoted interdiffusion between the filler and SiCp/Al composite, forming a metallurgically bonded joint upon cooling. The optimum spherical microstructure of the filler metal was obtained at 392°C, resulting in intense solid grain sliding during compression among the samples considered in this study. A significant disruption of the oxide film was observed at 392°C, and the joint showed shear strength of 105 MPa, reaching 78% of that of the base materials.
This Project was supported by the National Natural Science Foundation of China (No. 51435004).
Conflict of interest
There is no conflict of interest regarding the publication of this paper.
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