Interconnect Fabrication on Polymer Substrate using Submicron/Nano Silver Particles with the Assistance of Low-Density Irradiations
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Low-energy Xenon flash pulses permit sintering of spray-pyrolyzed submicron Ag particles (SMPs) into conductive tracks with acceptable electrical resistivity (16.7 μΩ cm) on polyimide film in several seconds without extra heating. Mixed with Ag nanoparticles (20% in weight ratio), the resistivity of the obtained sintered mixed pastes can be reduced to 12.6 μΩ cm, which is nearly the same as those formed using nanoparticle pastes (11.2 μΩ cm). Using irradiation on the polymer substrate side, more uniform sintered deposits with better electrical conductance (ρ < 10 μΩ cm) and greater bending fatigue resistance could be achieved. This sheds light on a new method for preparing low-cost, bendable Ag interconnections.
This work was supported by the Ministry of Science and Technology (Taiwan, R.O.C.) under contracts MOST 104-2628-E-005-001-MY2, for which the authors are grateful. This work was also supported by the “Innovation and Development Center of Sustainable Agriculture” from the Featured Research Center Program within the framework of the Higher Education Sprout Project by the Ministry of Education (Taiwan, R.O.C.).