Journal of Central South University

, Volume 18, Issue 2, pp 568–572 | Cite as

Thermal analysis of an innovative flat heat pipe radiator

  • Zhi-hai Kou (寇志海)
  • Min-li Bai (白敏丽)Email author
  • Hong-wu Yang (杨洪武)


An innovative flat heat pipe radiator was put forward, and it has the features of high efficiency of heat dissipation, compact construction, low thermal resistance, light weight, low cost, and anti-dust-deposition. The thermal analysis of the flat heat pipe radiator for cooling high-power light emitting diode (LED) array was conducted. The thermal characteristics of the flat heat pipe radiator under the different heat loads and incline angles were investigated experimentally in natural convection. An electro-thermal conversion method was used to measure the junction temperature of the LED chips. It is found that the integral temperature distribution of the flat heat pipe radiator is reasonable and uniform. The total thermal resistance of the flat heat pipe radiator varies in the range of 0.38–0.45 K/W. The junction temperatures of LED chips with the flat heat pipe radiator and with the aluminum board at the same forward current of 0.35 A are 52.5 and 75.2 °C, respectively.

Key words

energy technology thermal analysis flat heat pipe radiator thermal characteristics 


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Copyright information

© Central South University Press and Springer-Verlag Berlin Heidelberg 2011

Authors and Affiliations

  • Zhi-hai Kou (寇志海)
    • 1
  • Min-li Bai (白敏丽)
    • 1
    Email author
  • Hong-wu Yang (杨洪武)
    • 2
  1. 1.School of Energy and Power EngineeringDalian University of TechnologyDalianChina
  2. 2.Dalian Thermalway Heat Transfer Technology Co. Ltd.DalianChina

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