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Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag

  • Ping Zhou (周萍)Email author
  • Bing-ting Hu (胡炳亭)
  • Jie-min Zhou (周孑民)
  • Ying Yang (杨莺)
Article

Abstract

The experimental tests of tensile for lead-free solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 °C and strain rate range from 5×10−5 to 2×10−2 s−1, and its stress—strain curves were compared to those of solder Sn-37Pb. The parameters in Anand model for solder Sn-3.5Ag were fitted based on experimental data and nonlinear fitting method, and its validity was checked by means of experimental data. Furthermore, the Anand model was used in the FEM analysis to evaluate solder joint thermal cycle reliability. The results show that solder Sn-3.5Ag has a better creep resistance than solder Sn-37Pb. The maximum stress is located at the upper right corner of the outmost solder joint from the symmetric center, and thermal fatigue life is predicted to be 3.796×104 cycles under the calculated conditions.

Key words

lead free solder Sn-3.5Ag alloy Sn-37Pb alloy constitutive model tensile FEM analysis thermal cycle reliability 

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Copyright information

© Central South University Press and Springer-Verlag GmbH 2009

Authors and Affiliations

  • Ping Zhou (周萍)
    • 1
    Email author
  • Bing-ting Hu (胡炳亭)
    • 1
  • Jie-min Zhou (周孑民)
    • 1
  • Ying Yang (杨莺)
    • 1
  1. 1.School of Energy Science and EngineeringCentral South UniversityChangshaChina

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