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Special epoxy silicone adhesive for inertial confinement fusion experiment

  • Li Zhi-hua  (李芝华)Email author
  • Li Bo  (李波)
  • Zheng Zi-qiao  (郑子樵)
Article

Abstract

The effects of toughener and coupling agent on special epoxy silicone adhesive were discussed by researching the surface morphology characters, thermal properties and shear strength of the adhesive. The results indicate that silicone coupling agent (KH-550) can improve the shear strength of the epoxy silicone adhesive effectively. The mass fraction of the toughener in the epoxy silicone adhesive plays an important role in its properties. When the mass fraction of the toughener is less than 14%, the shear strength of the adhesive is low. When the mass fraction of the toughener is over 33%, thermal properties and shear strength of the adhesive decrease with the increasing of the toughener. The mass fraction of toughener of 25% results in good integral properties of the epoxy silicone adhesive. The morphologic analysis indicates that the micro-phase separation exists in the epoxy molecular chain and the silicone molecular chain of the epoxy silicone adhesive.

Key words

inertial confinement fusion experiment epoxy silicone toughener coupling agent micro-phase separation 

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References

  1. [1]
    LIU Cai-lin, WU Wei-dong, MAO Ying, et al. Hydrogen Isotopes Low Permeation Polymer Materials[J]. Material Review, 1998, 12(6): 53–55. (in Chinese)Google Scholar
  2. [2]
    LI Zhi-min, LIU Wen-xi, CHEN Yu-ru. The toughening materials of epoxy adhesives[J]. China Adhesives, 2003, 5(12): 46–48. (in Chinese)Google Scholar
  3. [3]
    OCHI M, SHIMAOKA S. Phase structure and toughness of silicone-modified epoxy resin with added silicone graft copolymer[J]. Polymer, 1999, 40(5):1305–1312.CrossRefGoogle Scholar
  4. [4]
    CHEN Wei-jun, ZHANG En-tian, GUO Xu, et al. The research present state and the development trend of Two part room temperature curing epoxy adhesives[J]. Chemistry and Adhesion, 2000, 3(10): 127–129.(in Chinese)Google Scholar
  5. [5]
    HUANG Yue-wen. Silicone adhesives[J]. Chemistry and Adhesion, 2001(1): 25–28.(in Chinese)Google Scholar
  6. [6]
    ZHU Ming, ZHAO Shi-qi, ZHANG Wei. Study of adhesion of T31 epoxy resin cured at ambient temperature[J]. Chemistry Materials for Construction, 2000(3): 27–30. (in Chinese)Google Scholar
  7. [7]
    HE Ping-sheng, LI Chun-e, OU Run-qing, et al. Study on T31-epoxy resin system[J]. Chemistry and Adhesion, 1996(4): 187–189.(in Chinese)Google Scholar
  8. [8]
    ZHANG Bao-long, TANG Guang-liang, SHI Ke-yu, et al. Studies on properties of epoxy resin modified by a modifier containing liquid crystalline unit—influence of the molecular weight of the flexible chains[J]. Acta Scientiarum Naturalium Universitatis Nankaiensis, 1999, 32(2): 1–5.(in Chinese)Google Scholar
  9. [9]
    LI Hai-bing, CHEN Yuan-yin. The sol-gel technique to prepare calyx[6]crown-containing organosilicon resins and their adsorption properties towards metal ions[J]. Reactive & Functional Polymers, 2003, 55(2): 171–178.CrossRefGoogle Scholar
  10. [10]
    ZHANG Qiu-yu, ZHANG He-peng, XIE Gang, et al. Effect of surface treatment of magnetic particles on the preparation of magnetic polymer microspheres by miniemulsion polymerization[J]. Journal of Magnetism and Magnetic Materials, 2007, 311(1): 152–157.Google Scholar
  11. [11]
    OCHI M, TAKAHASHI R, TERAUCHI A. Phase structure and mechanical and adhesion properties of epoxy/silica hybrids[J]. Polymer, 2001, 42(11): 5151–5158.CrossRefGoogle Scholar
  12. [12]
    ROBERT C, CRESPY A, BASTIDE S, et al. Adhesive properties of silicone polymers on some typical opto-electronic substrates: influence of the network density[J]. International Journal of Adhesion & Adhesives, 2004, 24(1): 55–68.CrossRefGoogle Scholar
  13. [13]
    ANANDA KUMAR S, DENCHEV Z, ALAGAR M. Synthesis and thermal characterization of phosphorus containing siliconized epoxy resins[J]. European Polymer Journal, 2006, 42(10): 2419–2429.CrossRefGoogle Scholar
  14. [14]
    ZHANG Bing, LIU Xiang-luan, HUANG Ying. Effects of the amino group content of polydimethylsiloxane bearing pendant amino groups on the morphology and properties of modified epoxy resin[J]. Journal of Functional Polymers, 2000, 13(1): 69–72.(in Chinese)Google Scholar
  15. [15]
    ANANDA KUMAR S, SANKARA NARAYANAN T S N. Thermal properties of siliconized epoxy interpenetrating coatings[J]. Progress in Organic Coatings, 2002, 45(4): 323–330.CrossRefGoogle Scholar
  16. [16]
    WANG W J, PERNG L H, HSIUE G H, et al. Characterization and properties of new silicone-containing epoxy resin[J]. Polymer, 2000, 41(16): 6113–6122.CrossRefGoogle Scholar

Copyright information

© Published by: Central South University Press, Sole distributor outside Mainland China: Springer 2007

Authors and Affiliations

  • Li Zhi-hua  (李芝华)
    • 1
    Email author
  • Li Bo  (李波)
    • 2
  • Zheng Zi-qiao  (郑子樵)
    • 1
  1. 1.School of Materials Science and EngineeringCentral South UniversityChangshaChina
  2. 2.Institute of Nuclear Physics and ChemistryChina Academy of Engineering PhysicsMianyangChina

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