Selective separation of copper by membrane-electro-winning and its application in etchant recycling
- 56 Downloads
- 1 Citations
Abstract
A close-looped process based on the membrane separation and electrolysis is proposed to regenerate the copper etchant in-situ, recover copper on-site and reuse it. It is characterized by selective separation of copper from the spent etchant, which is accomplished by the ion exchange membrane-electrowinning, and at the same time the other components useful for etching are reclaimed. The experiments show that at least 90% of electricity efficiency for copper removal can be maintained and the optimum condition for membrane-electrowinning is: cell voltage 2–2.5 V, operating temperature 40–50 °C and current density 500–1500 A/m2. The regenerated etchant can be successfully reused to etch copper after adjusting its composition to the normal range, and its recycling property is as good as that of the fresh etchant after 50 times of use-disposal-regeneration cycles.
Key words
copper etchant membrane-electrowinning(M-E) recycle selective separationCLC number
X383Preview
Unable to display preview. Download preview PDF.
References
- [1]Ballantine A W. Etch process and apparatus therefore [P]. US 20040144750, 2004.Google Scholar
- [2]Lillie D. Etching solution for forming an embedded resistor[P]. US 20030150840, 2003.Google Scholar
- [3]Aegerter B. Selective treatment of the surface of a microelectronic workpiece[P]. US 20050020001, 2005.Google Scholar
- [4]Richard H W. Additives for copper etchants[P]. CN94193307, 1994.Google Scholar
- [5]David M A. Increasing utilization efficiency of ferric chloride etchant in industrial photochemical machine [J]. J Environ Monit, 1998(1): 103–108.Google Scholar
- [6]Culpovich P. Automatic etchant regeneration system with highly accurate sensor for monitoring etchant composition[P]. US 6551521, 2003.Google Scholar
- [7]Barrett D G. Cupric chloride regeneration[J]. Journal PCMI, 1991, 4: 15–17.Google Scholar
- [8]David M A. The potential of oxygen for regeneration of spent ferric chloride etchant solutions[J]. The Journal (PCMI), 1995, 6: 3–6.Google Scholar
- [9]LI De-liang. Recycling methods and related apparatus for copper etchants[P]. CN0315367, 2003.Google Scholar
- [10]LI De-liang, WU Xiao-hu. Selective removal of nickel from iron substrate by non-cyanide strippers [J]. Trans Nonferrous Met Soc China, 2004, 14(3): 599–603.Google Scholar
- [11]LI De-liang, WANG Dian-zhuo. Selective leaching Ni (II) from AMD sludge by using ethylenediamine-ammonium sulfate[J]. Trans Nonferrous Met Soc China, 2002, 12(6): 1176–1179.Google Scholar
- [12]TANG Dian. Electroless copper plating on difficultly deposited substrates by using glyoxylic acid as reducing agent[J]. The Chinese Journal of Nonferrous Metals, 2003, 13(5): 1252–1256. (in Chinese)Google Scholar
- [13]LIU Xiao-rong. Effect of Lix984N content on phase disengagement dynamics in copper-SX[J]. Trans Nonferrous Met Soc China, 2003, 13(4): 963–967.Google Scholar
- [14]LI Shi-xiong. Industrial control of copper electrolysis additive[J]. The Chinese Journal of Nonferrous Metals, 2004, 14(1): 132–137. (in Chinese)Google Scholar
- [15]CHEN Bu-shen. Non-toxic process for copper recovery(II)—copper separation by N(530) extractant and its electrowinning[J]. Nonferrous Metals, 1998(3): 403–407. (in Chinese)Google Scholar
- [16]Glazunova Z S, et al. Electrolytic process of regeneration of pickling solutions[P]. RU2180693, 2002.Google Scholar
- [17]SHI Jun. Handbook on Membrane Technology[M]. Beijing: Chemical Industry Press, 2001. 425–480.Google Scholar
- [18]WEI Qi-feng, ZHANG Qi-xiu. Preparation of copper powder by cation-exchange membrane coupling electrolysis[J]. J Cent South Uni, 2004, 35(supple 1): 154–158. (in Chinese)Google Scholar
- [19]WEI Qi-feng, ZHANG Qi-xiu. Preparation of copper powder by anion-exchange membrane electrolysis[J]. Nonferrous Metallurgy, 2003, 32(3): 10–14. (in Chinese)Google Scholar