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Journal of Central South University of Technology

, Volume 12, Issue 6, pp 709–713 | Cite as

Thermal stress in SiC element used in heat exchanger

  • Li He-song Email author
  • Mei Chi 
Article

Abstract

An especial snake SiC pipe was designed for collecting losing heat from furnaces. The three-dimensions thermal, fluid and thermal stress coupled field of heat exchanger was analyzed by using the commercial engineering computer package ANSYS. The structural and operational parameters of heat exchanger, the junction between standpipe and snake pipe, the diameter of snake pipe, ratio of thickness to diameter of pipe, velocity of inlet air were optimized for thermal stress. The computed results show that the large thermal stress exits in the SiC, and the stand pipe should be ellipse for the least thermal stress; the optimal ratio of thickness to diameter of pipe is 6, the velocity of inlet air is 25 m/s. The most thermal stress is in inverse proportion to diameter of pipe and velocity of inlet air.

Key words

finite element method simulation heat exchanger element thermal stress 

CLC number

TF821 TP391 

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Copyright information

© Central South University 2005

Authors and Affiliations

  1. 1.School of Energy and Power EngineeringCentral South UniversityChangshaChina

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