Thermal stress in SiC element used in heat exchanger
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An especial snake SiC pipe was designed for collecting losing heat from furnaces. The three-dimensions thermal, fluid and thermal stress coupled field of heat exchanger was analyzed by using the commercial engineering computer package ANSYS. The structural and operational parameters of heat exchanger, the junction between standpipe and snake pipe, the diameter of snake pipe, ratio of thickness to diameter of pipe, velocity of inlet air were optimized for thermal stress. The computed results show that the large thermal stress exits in the SiC, and the stand pipe should be ellipse for the least thermal stress; the optimal ratio of thickness to diameter of pipe is 6, the velocity of inlet air is 25 m/s. The most thermal stress is in inverse proportion to diameter of pipe and velocity of inlet air.
Key wordsfinite element method simulation heat exchanger element thermal stress
CLC numberTF821 TP391
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- Vallés A, Lenis V. Prediction of ledge profile in hall-Héroult cells[A]. James W E. Light Metals[C]. Las Vegas: TMS, 1995. 309–313.Google Scholar
- Dupuis M, Tabsh I. Thermo-electric analysis of the grande-baie aluminum reduction cell[A]. Mannweiler U. Light Metals[C]. San Francisco: TMS, 1994. 339–342.Google Scholar
- Suces J. Analytical solution for unsteady heat transfer in a pipe[J]. J Heat Transfer, 1988, 110(6): 850–854.Google Scholar
- Sinha R. Thermal stress analysis of a hollow thick cylinder by the finite element method[J]. J Inst Eng Mech Eng Div, 1978, 59(3): 131–133.Google Scholar
- Fauple J H, Fisher F E. Engineering Design: A Synthesis of Stress Analysis and Material Engineering [M]. New York: Wiley, 1981.Google Scholar