Journal of Failure Analysis and Prevention

, Volume 14, Issue 6, pp 697–701 | Cite as

Failure Analysis: Why Mistakes Are Made and How to Avoid Making One

Feature

Keywords

Failure Mode Print Circuit Board Failure Analysis Corrective Action Excessive Current 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

References

  1. 1.
    P. Jacobs “EOS (Electrical Overstress)—The Old, Unknown Phenomena?” Int. Symp. Test. Fail. Anal. (ISTFA), 2012, pp. 156-63Google Scholar
  2. 2.
    M. Gores “Mis-Identified Failures in FETs,” Int. Symp. Test. Fail. Anal. (ISTFA), 2008, pp. 481-84Google Scholar
  3. 3.
    R. King, C. Van Schaick, and J. Lusk “Electrical Overstress of Nonencapsulated Aluminum Bond Wires,” Int. Reliab. Phys. Symp. (IRPS), 1989, pp. 141-51Google Scholar
  4. 4.
    A. Munukutla, R. Rahn, and J. Lewis “Damage-Induced Field Failures of Electrical Contacts,” Int. Symp. Test. Fail. Anal. (ISTFA), 2009, pp. 347-51Google Scholar

Selected References

  1. M. Horev Root Cause Analysis in Process-Based Industries, Trafford Publishing, 2008Google Scholar
  2. C. Kepner, B. Tregoe, The Rational Manager: A Systematic Approach to Problem Solving and Decision-Making (McGraw-Hill Book Company, New York, 1965)Google Scholar
  3. R. Latino and K. Latino Root Cause Analysis: Improving Performance for Bottom Line Results, CRC Press, 1999Google Scholar

Copyright information

© ASM International. Reprinted with permission from Electronic Device Failure Analysis, 2014, 16(4), pp 4-12 2014

Authors and Affiliations

  1. 1.Accelerated AnalysisHalf Moon BayUSA

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