Chemical Failure Mode Addition to the Failure Mode Taxonomy
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Abstract
The research objective of this article is to fortify the failure mode taxonomy by including chemical failures. This inclusion would enable comprehensive risk analysis in technology-based products. As technology improves at an exponential rate, partially owing to chemical advances in the semiconductor industry, failure identification tools must keep up with the pace. While the current version of the failure mode taxonomy does consider multiple domains of failure, it does not include a comprehensive collection of chemical failures. Therefore this taxonomy is insufficient for a large number of new products. The research presented here includes identifying chemical failures from publications in the semiconductor industry. These failures were then analyzed to determine the rudimentary failure modes in each case. Finally the newly identified failure modes were added to the failure mode taxonomy. A case study is presented to demonstrate using the updated failure mode taxonomy to identify both potential failures and product risks.
Keywords
Failure analysis Failure mode Taxonomy Chemical LithographyReferences
- 1.Jelinek, L.: Semiconductor industry revenue to endure slow growth in 2012. IHS iSuppli. http://www.isuppli.com/Semiconductor-Value-Chain/News/Pages/Semiconductor-Industry-Revenue-to-Endure-Slow-Growth-in-2012.aspx. Accessed 31 Jan 2012
- 2.Moore, G.: Cramming more components onto integrated circuits. Electronics 38(8), 114–117 (1965)Google Scholar
- 3.Okoroanyanwu, U.: Chemistry in Lithography. SPIE Press/Wiley, Bellingham (2010)Google Scholar
- 4.Takahashi, D.: Intel’s billion-dollar mistake: why chip flaws are so hard to fix. Venturebeat News. http://venturebeat.com/2011/01/31/intels-billion-dollar-mistake-why-chip-flaws-are-so-hard-to-fix/. Accessed 31 Jan 2011
- 5.Mack, C.: Fundamental Principles of Optical Lithography: The Science of Microfabrication. Wiley, West Sussex (2007)CrossRefGoogle Scholar
- 6.Occupational Safety and Health Administration: Process Safety Management of Highly Hazardous Chemicals; Explosives and Blasting Agents; Final Rule (29 CFR 1910.119). U.S. Government Printing Office, Washington, DC (1992)Google Scholar
- 7.Ericson, C.: Proceedings of the 17th International Systems Safety Conference, Orlando (1999)Google Scholar
- 8.Wu, J.S., Apostolakis, G.E., Okrent, D.: The Analysis, Communication, and Perception of Risk. Plenum Press, New York (1991)Google Scholar
- 9.Kletz, T.A.: HAZOP & HAZAN Notes on the Identification and Assessment of Hazards. The Institute of Chemical Engineers, Rugby (1983)Google Scholar
- 10.Center for Chemical Process Safety: Guidelines for Safe Automation of Chemical Processes. Wiley-AIChE (1993)Google Scholar
- 11.Chrysler Corporation, Ford Motor Company and General Motors: Quality System Requirements QS-9000, 2nd edn. International Organization for Standardization (1995)Google Scholar
- 12.Grantham Lough, K., Stone, R., Tumer, I.: Failure prevention through effective cataloguing and utilization of historical failure events. J. Fail. Anal. Prev. 8(5), 469–481 (2008)CrossRefGoogle Scholar
- 13.Grantham Lough, K., Stone, R., Tumer, I.: The risk in early design method (RED). J. Eng. Des. 20(2), 155–173 (2009)CrossRefGoogle Scholar
- 14.Vesely, W.E., Goldberg, F.F., Roberts, N.H., Haasi, D.F.: The Fault Tree Handbook (NUREG 0492). U.S. Government Printing Office, Washington, DC (1981)Google Scholar
- 15.Kumamoto, H., Henley, E.: Probabilistic Risk Assessment and Management for Engineers and Scientists. IEEE Press, New York (1996)Google Scholar
- 16.O’Connor, P., Newton, D., Bromley, R.: Practical Reliability Engineering. Wiley, West Sussex (2009)Google Scholar
- 17.Arendt, J.S., Fussell, J.B.: System Reliability Engineering Methodology for Industrial Application. Loss Prev. 14, 18–28 (1981)Google Scholar
- 18.Andrews, J.D., Morgan, J.M.: Application of the digraph method of fault tree construction to process plant. Reliab. Eng. Syst. Saf. 14(2), 85–106 (1986)Google Scholar
- 19.Mullhia, J.S., Ang, M.L., Kelly, B.E., Less, F.P., Andrews, J.D.: The propagation of faults in process plants: fault tree synthesis for a butane vaporizer system. Reliab. Eng. Syst. Saf. 23, 31–49 (1988)CrossRefGoogle Scholar
- 20.Rasmussen, N.C.: Reactor Safety Study: An Assessment of Accident Risks in US Commercial Nuclear Power Plants (NUREG-75/014). U.S. Government Printing Office, Washington, DC (1975)Google Scholar
- 21.Lawley, H.G.: Operability studies and hazard analysis. Chem. Eng. Prog. 70(4), 45–56 (1974)Google Scholar
- 22.Venkatasubramanian, V., Zhao, J., Viswanathan, S.: Intelligent systems for HAZOP analysis of complex process plants. Chem. Eng. 38(9–10), 2291–2302 (2000)Google Scholar
- 23.Kletz, T.A.: What went wrong?—case histories of process plant disasters, 2nd edn. Gulf Publishing, Houston (1988)Google Scholar
- 24.Department of Defense: Procedure for Performing a Failure Mode Effect and Criticality Analysis (MIL-P-1629). U.S. Government Printing Office, Washington, DC (1949)Google Scholar
- 25.National Aeronautics and Space Administration: Procedure for Failure Mode, Effects and Criticality Analysis (RA-006-013-1A). U.S. Government Printing Office, Washington, DC (1966)Google Scholar
- 26.Modarres, M., Kaminskiy, M., Krisvtsov, V.: Reliability and Risk Analysis a Practical Guide. CRC Press, New York (2010)Google Scholar
- 27.Center for Process Safety: Guidelines for Hazard Evaluation Procedures; with Worked Examples, 2nd edn. American Institute of Chemical Engineers (1992)Google Scholar
- 28.Andrews, J.D., Dunnett, S.J.: Event-tree analysis using binary decision diagrams. IEEE Trans. Reliab. 49(2), 230–238 (2000)CrossRefGoogle Scholar
- 29.Hadipriono, F.C., Lim, C.L., Wong, K.H.: Event tree analysis to prevent failures in temporary structures. J. Constr. Eng. Manag. 112(4), 500–513 (1986)CrossRefGoogle Scholar
- 30.Dowell, A.: Layer of protection analysis and inherently safer processes. Process Saf. Prog. 18(4), 214–220 (1999)CrossRefGoogle Scholar
- 31.Dowell, A., Hendershot, D.: Simplified Risk Analysis-Layer of Protection Analysis (LOPA). American Institute of Chemical Engineers, Indianapolis, IN (2002)Google Scholar
- 32.Center for Chemical Process Safety: Layer of Protection Analysis, Simplified Process Risk Assessment. Wiley-AIChE, American Institute of Chemical Engineers, New York (2001)Google Scholar
- 33.Tumer, I., Stone, R., Bell, D.: Proceedings of the International Conference on Engineering Design, Stockholm (2003)Google Scholar
- 34.Ombete, K.: Preventing Chemical Product Failure. Masters thesis. Retrieved from the Missouri University of Science and Technology (2009)Google Scholar
- 35.Carr, B., Evers, A. Weimer, M. Smith, B., Leith, J.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2010)Google Scholar
- 36.Neef, C., Thomas, D.: Proceedings of the 6th International Conference on Semiconductor Technology, Shanghai (2007)Google Scholar
- 37.Brown, T.L., LeMay, H.E., Burseten, B.: Chemistry the Central Science, 6th edn. Prentice Hall, Englewood Cliffs (1994)Google Scholar
- 38.Strong, J.: Procedures in Experimental Physics. Lindsay Publications, Bradley (1938)Google Scholar
- 39.Xu, H., Blackwell, J.M., Younkin, T.R., Min, K.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2009)Google Scholar
- 40.Cao, H.B., Roberts, J.M., Dalin, J., Chandhok, M., Meagley, R.P., Panning, E.M., Rice, B.J.: Proceedings. EUVL Symposium, Dallas (2002)Google Scholar
- 41.Jurajda, D., Tenaglia, E., Jeauneau, J., Simone, D.D., Zhu, Z., Piazza, P., Piacentini, P., Canestrari, P.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2009)Google Scholar
- 42.Guerrero, D.J., Krishnamurthy, V., Sullivan, D.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2011)Google Scholar
- 43.Lowes, J., Guerrero, A., Weigand, M., Washburn, C., Stroud, C., Sharma, S., Torres, D., Slezak, M., Dabbagh, G., Tang, C.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2011)Google Scholar
- 44.Swope, M., Krishnamurthy, V., Zhu, Z., Sullivan, D., Simmons, S., Cox, C., Bennett, R., Nesbit, C.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2011)Google Scholar
- 45.Neef, C.J., Finazzo, J., Nesbit, C., Weigand, M.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2008)Google Scholar
- 46.Guerrero, D.J., Sullivan, D.M., Zhu, Z., Mercado, R.L.: Simulation and experimental study on multilayer double-patterning processes. Electrochem. Soc. Trans. 27(1), 378–473 (2010)Google Scholar
- 47.Lowes, J., Pham, V., Meador, J., Stroud, C., Rosas, F., Mercado, R.L., Slezak, M.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2010)Google Scholar
- 48.Guerrero, D.J., Xu, H., Mercado, R., Blackwell, J.: Underlayer designs to enhance EUV resist performance. J. Photopolym. Sci. Technol. 22(1), 117–122 (2009)CrossRefGoogle Scholar
- 49.Werner, T., Steinmetz, J., Kiene, M., Eggenstein, B., Richter, F., Kahlenberg, F., Heghoyan, S., Jurajda, D., Sullivan, D.: Using soluble gap-fill materials in VFTL integration. Solid State Technol. 52(8) (2009). http://www.electroiq.com/articles/sst/2009/08/using-soluble-gap-fill-materials-in-vftlintegration.html
- 50.Turner, S.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2007)Google Scholar
- 51.Smith, B., McGarvey, S., Zhu, Z., Wang, Y., Sullivan, D.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2010)Google Scholar
- 52.Harumoto, M., Negoro, S., Hisai, A., Tanaka, M., Mori, G., Slezak, M.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2009)Google Scholar
- 53.Guerrero, D.J., Sullivan, D., Mercado, R.L.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2009)Google Scholar
- 54.Washburn, C., Evers, A., Smith, B.: Residue testing of developer-soluble bottom anti-reflective coatings. Electrochem. Soc. Trans. 18(1), 419–425 (2009)Google Scholar
- 55.Dalvi-Malhotra, J., Zhong, X.F., Planje, C., Brand, G., Yess, K.: A spin-on photosensitive polymeric etch protection mask for anisotropic wet etching of silicon. J. Micromechanics Microengineering 18(2), 025029-1–025029-8 (2008)Google Scholar
- 56.Puligadda, R., Pillalamarri, S., Hong, W., Brubaker, C., Wimplinger, M., Pargfrieder, S.: Proceedings of the Materials Research Society Symposium (2006)Google Scholar
- 57.Macie, J., Miranda, D., Zhu, Z., Smith, B.: Optimizing lithographic stack materials when using hyper-NA exposure tools. Solid State Technol. 52(1) (2009). http://www.electroiq.com/articles/sst/2009/01/optimizing-lithographic-stack-materials-when-using-hyper-na-exposure-tools.html
- 58.Zhu, Z., Piscani, E., Edwards, K., Smith, B.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2008)Google Scholar
- 59.Guerrero, D.J., Smith, T., Kato, M., Kimura, S., Enomoto, T.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2006)Google Scholar
- 60.Neef, C.J., Smith, B., James, C., Zhu, Z., Weigand, M.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2009)Google Scholar
- 61.Bae, Y.C., Liu, Y., Cardolaccia, T., Spizuoco, K., Bell, R., Joesten, L., Pikon, A., Reilly, M., Ablaza, S., Trefonas, P., Barclay, G.G.: Proceedings of the International Society for Optics and Photonics: Advanced Lithography, San Jose (2009)Google Scholar