Dissimilar Joining of Pure Aluminum to SiCp/Al-MMCs Using an AlMgGaLi Active Interlayer Foil
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To broaden the application of advanced metal matrix composites in the electronic packaging industry, a lead-free AlMgGaLi interlayer was developed for active soldering of aluminum to aluminum metal matrix composites. The effect of joining pressure on the microstructure evolution, interfacial wettability and mechanical properties of the dissimilar joints was investigated. The experimental results indicated that as the joining pressure increased, the mean thickness of the bond seam was 46.02 μm, and solidification of a solid solution occurred (detected by SEM/XRD analysis). The composition of the Al-based solid solution (in atom%) was 86.52% Al, 9.32% Mg, 2.56% O, 1.5% Ga and 0.1% Si. The pressure improved the interfacial wettability by enhancing the atom diffusion between the interlayer and parent materials. The joint shear strength initially increased and then decreased, and a sound joint with a maximum shear strength of ~ 45 MPa was produced at 450 °C and 0.75 MPa. The fracture crack initially occurred at the interfaces of the Al/filler metal and then propagated mainly along the Al2O3 layer on the Al side. A novel model describing the pressure-induced microstructure changes within the joint and the formation of an Al2O3 diffusion barrier layer at the Al/filler metal interface is proposed.
Keywordsactive soldering aluminum metal matrix composites dissimilar joints lead-free Al-based interlayer
The present research was funded by the National Natural Science Foundation of China (No. 51275390) and the China Scholarship Council. The authors would like to express sincere gratitude to Prof. Z. Chen (School of Materials Science and Engineering, Nanyang Technological University) and Dr. C. Xin for their careful reading and valuable criticisms to improve this manuscript.
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