Nanomechanical Responses of an Intermetallic Compound Layer in Transient Liquid Phase Bonding Using Indium

  • Jenn-Ming SongEmail author
  • Wei-Chih Lu
  • Pei-Wen Chou
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
Part of the following topical collections:
  1. TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder


Low-temperature transient liquid phase bonding (TLPB) can be achieved using indium, and the joints thus formed can withstand high temperatures. Since the joints that are formed with TLPB entirely consist of intermetallic compounds (IMCs), this study investigates the phase evolution and mechanical properties of IMCs that are obtained from isothermal reactions between In and commonly used substrate metals, Cu, Ag and Au. Using nanoindentation, the relationships between the yield strain, work hardening exponent and strain rate sensitivity of In-bearing and other frequently observed IMC phases were compared. Notably, the strain-induced precipitation of Ag3In occurred in the indent of Ag9In4.


transient liquid phase bonding (TLPB) intermetallic compounds nanoindentation 


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This work was supported by the Ministry of Science and Technology (Taiwan) through Grant MOST 106-2221-E-005-028-MY3, for which the authors are grateful. This work was also supported by the ‘‘Innovation and Development Center of Sustainable Agriculture’’ from the Featured Research Center Program within the framework of the Higher Education Sprout Project by the Ministry of Education (Taiwan, R.O.C.).


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Copyright information

© The Minerals, Metals & Materials Society 2019

Authors and Affiliations

  1. 1.Department of Materials Science and EngineeringNational Chung Hsing UniversityTaichungTaiwan
  2. 2.Department of Materials Science and EngineeringNational Dong Hwa UniversityHualienTaiwan
  3. 3.Research Center for Sustainable Energy and NanotechnologyNational Chung Hsing UniversityTaichungTaiwan
  4. 4.Innovation and Development Center of Sustainable AgricultureNational Chung Hsing UniversityTaichungTaiwan

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