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Nanomechanical Responses of an Intermetallic Compound Layer in Transient Liquid Phase Bonding Using Indium

  • Jenn-Ming SongEmail author
  • Wei-Chih Lu
  • Pei-Wen Chou
TMS2019 Microelectronic Packaging, Interconnect, and Pb-free Solder
  • 3 Downloads
Part of the following topical collections:
  1. TMS2019 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder

Abstract

Low-temperature transient liquid phase bonding (TLPB) can be achieved using indium, and the joints thus formed can withstand high temperatures. Since the joints that are formed with TLPB entirely consist of intermetallic compounds (IMCs), this study investigates the phase evolution and mechanical properties of IMCs that are obtained from isothermal reactions between In and commonly used substrate metals, Cu, Ag and Au. Using nanoindentation, the relationships between the yield strain, work hardening exponent and strain rate sensitivity of In-bearing and other frequently observed IMC phases were compared. Notably, the strain-induced precipitation of Ag3In occurred in the indent of Ag9In4.

Keywords

transient liquid phase bonding (TLPB) intermetallic compounds nanoindentation 

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Notes

Acknowledgments

This work was supported by the Ministry of Science and Technology (Taiwan) through Grant MOST 106-2221-E-005-028-MY3, for which the authors are grateful. This work was also supported by the ‘‘Innovation and Development Center of Sustainable Agriculture’’ from the Featured Research Center Program within the framework of the Higher Education Sprout Project by the Ministry of Education (Taiwan, R.O.C.).

References

  1. 1.
    H.S. Chin, K.Y. Cheong, and A.B. Ismail, Metall. Mater. Trans. 41, 824 (2010).CrossRefGoogle Scholar
  2. 2.
    J.G. Bai, J. Yin, Z. Zhang, G.Q. Lu, and J.D. Wyk, IEEE Trans. Adv. Packag. 30, 506 (2007).CrossRefGoogle Scholar
  3. 3.
    K. Suganuma, S.J. Kim, and K.S. Kim, JOM 61, 64 (2009).CrossRefGoogle Scholar
  4. 4.
    S.J. Kim, K.S. Kim, K. Suganuma, and G. Izuta, J. Electron. Mater. 38, 873 (2009).CrossRefGoogle Scholar
  5. 5.
    S. Zhang, S.H. Kim, T.W. Kim, Y.S. Kim, and K.W. Paik, IEEE Trans. Compon. Packag. Manuf. Technol. 5, 9 (2015).CrossRefGoogle Scholar
  6. 6.
    S. Zhang and K.W. Paik IEEE Trans. Compon. Packag. Manuf. Technol. 6, 216 (2016).CrossRefGoogle Scholar
  7. 7.
    S. Zhang, M. Yang, Y. Wu, J. Du, T. Lin, P. He, M. Huang, and K.W. Paik, IEEE Trans. Compon. Packag. Manuf. Technol. 8, 383 (2018).CrossRefGoogle Scholar
  8. 8.
    W.C. Warren III, J. Chae, and K. Najafi, IEEE Trans. Adv. Packag. 28, 643 (2005).CrossRefGoogle Scholar
  9. 9.
    Y.Y. Wu and C.C. Lee, IEEE Trans. Compon. Packag. Manuf. Technol. 3, 711 (2013).CrossRefGoogle Scholar
  10. 10.
    C.C. Lee, S.J. Hsu, and Y.Y. Wu, J. Electron. Mater. 43, 9 (2014).CrossRefGoogle Scholar
  11. 11.
    W. Zhang and W. Ruythooren, J. Electron. Mater. 37, 1095 (2008).CrossRefGoogle Scholar
  12. 12.
    H.A. Mustain, W.D. Brown, and S.S. Ang, IEEE Trans. Compon. Packag. Technol. 33, 563 (2010).CrossRefGoogle Scholar
  13. 13.
    T.T. Luu, N. Hoivik, K. Wang, K.E. Aasmundtveit, and A.S.B. Vardøy, Metall. Mater. Trans. A 46, 2637 (2015).CrossRefGoogle Scholar
  14. 14.
    W.W. So and C.C. Lee, IEEE Trans. Compon. Packag. Technol. 23, 377 (2000).CrossRefGoogle Scholar
  15. 15.
    L. Deillon, T. Hessler, A. Hessler-Wyser, and M. Rappaz, Acta Mater. 79, 258 (2014).CrossRefGoogle Scholar
  16. 16.
    J. Lian, J.W. Chun, M.S. Goorsky, and J. Wang, J. Mater. Sci. 44, 6155 (2009).CrossRefGoogle Scholar
  17. 17.
    R.I. Made, C.L. Gan, L.L. Yan, A. Yu, S.W. Yoon, J.H. Lau, and C. Lee, J. Electron. Mater. 38, 365 (2009).CrossRefGoogle Scholar
  18. 18.
    P.J. Wang, C.H. Sha, and C.C. Lee, IEEE Trans. Compon. Packag. Technol. 33, 462 (2010).CrossRefGoogle Scholar
  19. 19.
    S.J. Hsu, C.C. Lee, ECTC. (2015), p. 1247.Google Scholar
  20. 20.
    W.P. Lin and C.C. Lee, IEEE Trans. Compon. Packag. Manuf. Technol. 1, 1311 (2011).CrossRefGoogle Scholar
  21. 21.
    Y.Y. Wu, D. Nwoke, F.D. Barlow, and C.C. Lee, IEEE Trans. Compon. Packag. Manuf. Technol. 4, 1420 (2014).CrossRefGoogle Scholar
  22. 22.
    K.A. Lindahl, J.J. Moore, D.L. Olson, R. Noufi, and B. Lanning, Thin Solid Films 290, 518 (1996).CrossRefGoogle Scholar
  23. 23.
    D.G. Kim, C.Y. Lee, and S.B. Jung, J. Mater. Sci.: Mater. Electron. 15, 95 (2004).Google Scholar
  24. 24.
    Y.S. Chien, Y.P. Huang, R.N. Tzeng, M.S. Shy, T.H. Lin, K.H. Chen, C.T. Chiu, C.T. Chuang, W. Hwang, J.C. Chiou, H.-M. Tong, and K.N. Chen, IEEE Trans. Electron. Devices 61, 1131 (2014).CrossRefGoogle Scholar
  25. 25.
    Y. Tian, N. Wang, Y. Li, C. Wang, 13th ICEPT-HDP (2012), p. 216.Google Scholar
  26. 26.
    X. Zhao, Y. Tian, N. Wang, 14th ICEPT (2013), p. 143.Google Scholar
  27. 27.
    X. Deng, N. Chawla, K.K. Chawla, and M. Koopman, Acta Mater. 52, 4291 (2004).CrossRefGoogle Scholar
  28. 28.
    J.M. Song, Y.L. Shen, C.W. Su, Y.S. Lai, and Y.T. Chiu, Mater. Trans. 50, 1231 (2009).CrossRefGoogle Scholar
  29. 29.
    J.M. Song, C.W. Su, Y.S. Lai, and Y.T. Chiu, J. Mater. Res. 25, 629 (2010).CrossRefGoogle Scholar
  30. 30.
    J.M. Song, B.R. Huang, C.Y. Liu, Y.S. Lai, Y.T. Chiu, and T.W. Huang, Mater. Sci. Eng., A 534, 53 (2012).CrossRefGoogle Scholar
  31. 31.
    J.Y. Wu, Y.S. Chiu, Y.W. Wang, and C.R. Kao, Mater. Sci. Eng., A 753, 22 (2019).CrossRefGoogle Scholar
  32. 32.
    J.M. Song, W.C. Lu, International Conference on Electronic Packaging (ICEP) (2014), pp. 640–643.Google Scholar
  33. 33.
    W.C. Oliver and G.M. Pharr, J. Mater. Res. 564, 1564 (1992).CrossRefGoogle Scholar
  34. 34.
    M. Dao, N. Chollacoop, K.J.V. Vliet, T.A. Venkatesh, and S. Suresh, Acta Mater. 49, 3899 (2001).CrossRefGoogle Scholar
  35. 35.
    C. Fisher-Cripps, Nanoindentation, 2nd ed. (New York: Springer, 2004), p. 146.CrossRefGoogle Scholar
  36. 36.
    Y.V. Milman, B.A. Galanov, and S.I. Chugunova, Acta Mater. 41, 2523 (1993).CrossRefGoogle Scholar

Copyright information

© The Minerals, Metals & Materials Society 2019

Authors and Affiliations

  1. 1.Department of Materials Science and EngineeringNational Chung Hsing UniversityTaichungTaiwan
  2. 2.Department of Materials Science and EngineeringNational Dong Hwa UniversityHualienTaiwan
  3. 3.Research Center for Sustainable Energy and NanotechnologyNational Chung Hsing UniversityTaichungTaiwan
  4. 4.Innovation and Development Center of Sustainable AgricultureNational Chung Hsing UniversityTaichungTaiwan

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