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Effect of Bismuth Addition on Physical Properties of Sn-Zn Lead-Free Solder Alloy

  • Athil Al-EzziEmail author
  • Abbas Al-Bawee
  • Feryal Dawood
  • Abeer A. Shehab
Article
  • 5 Downloads

Abstract

The aim of this work is to improve the properties of eutectic Sn-9Zn solder alloy by adding different amounts of bismuth to produce alternate lead-free solder alloys for use in electronic applications. Phase identification of the various solders was performed by x-ray diffraction analysis. Scanning electron microscopy was employed for morphological characterization of the prepared solder alloys. Spreading tests were used to measure the contact angle, and the electrical resistance was measured. Differential scanning calorimetry (DSC) thermographs were obtained for the alternate lead-free alloys. The results showed that Bi addition could clearly improve the wettability and physical properties of the Sn-9Zn base alloy by decreasing the melting point.

Keywords

Sn-9Zn lead-free solder melting point pasty range contact angle electrical resistivity 

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Notes

Acknowledgments

The High Ministry of Education and Scientific Research is acknowledged for support.

Supplementary material

11664_2019_7577_MOESM1_ESM.pdf (648 kb)
Supplementary material 1 (PDF 647 kb)

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Copyright information

© The Minerals, Metals & Materials Society 2019

Authors and Affiliations

  1. 1.Materials Engineering DepartmentUniversity of DiyalaDiyalaIraq
  2. 2.Science DepartmentUniversity of DiyalaDiyalaIraq

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