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Journal of Electronic Materials

, Volume 48, Issue 10, pp 6815–6822 | Cite as

AgNi Alloy As a Suitable Barrier Layer Material for NbFeSb-Based Half-Heusler Thermoelectric Modules

  • Jiaxu Zhu
  • Fusheng LiuEmail author
  • Bo Gong
  • Xiao Wang
  • Weiqin Ao
  • Chaohua Zhang
  • Yu Li
  • Lipeng Hu
  • Heping Xie
  • Kunming GuEmail author
  • Junqin Li
Article
  • 18 Downloads

Abstract

As a type of moderate- and high-temperature thermoelectric materials, half-Heusler thermoelectric materials have a unique advantage in terms of their power factors and mechanical properties, and the figure of merit (ZT) of FeNb0.88Hf0.12Sb reaches 1.0 at 600°C. In this paper, after taking into account factors such as electrical conductivity, thermal conductivity, melting point, and metal activity, silver (Ag) was selected as the barrier layer material. The barrier layer and thermoelectric materials were welded together by atomic diffusion using spark plasma sintering. There was no obvious elemental diffusion on the connection surface after sintering, indicating that Ag did not impact the performance of FeNb0.88Hf0.12Sb. However, many cracks appeared on the joint surface during the aging process. In further experiments, we added a small amount of nickel (Ni) into the Ag to achieve a close connection between the barrier layer and FeNb0.88Hf0.12Sb. Moreover, we analyzed the interface of the intermetallic compounds after aging for 192 h, which showed that Ni3Nb and Ni6Nb7 compounds formed at the interface. The contact resistance was tested by a scanning probe method, and the resistivity of the barrier layer was determined to be 0.4 μΩ cm2, which is far less than that of other barrier layers. Moreover, the connection strength was greater than 40 MPa. When Ag0.9Ni0.1 was used as the barrier layer to compose the half-Heusler thermoelectric module, the thermoelectric conversion efficiency reached 7.33%, and there was no significant decrease in efficiency during the cyclic test.

Keywords

Thermoelectric module half-Heusler contact resistance intermetallic compounds 

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Notes

Acknowledgments

This work was supported by the National Natural Science Foundation of China (Nos. 51701126 and 51571144) and the Shenzhen Science and Technology Research Grant (No. JCYJ20150827155136104).

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Copyright information

© The Minerals, Metals & Materials Society 2019

Authors and Affiliations

  1. 1.Shenzhen Key Laboratory of Special Functional Materials, Shenzhen Engineering Laboratory for Advanced Technology of Ceramics, Guangdong Research Center for Interfacial Engineering of Functional Materials, College of Materials Science and Engineering, Institute of Deep Underground Sciences and Green EnergyShenzhen UniversityShenzhenPeople’s Republic of China

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