Surface Treatments and Modifications of Si Wafers Produced by Czochralski Method for Solar Cell Applications
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The objective of this work is to carry out surface treatments and modification of single-crystal silicon (Si) wafers produced by the Czochralski (Cz) method for solar cell applications. Lapping and polishing processes were performed on Si wafers for removing saw damages which occurred when sliced Si ingot was grown in the Cz system. The appropriate time and speed for the slicing process were determined as a result of parameter studies. The wet texturing process was generated with different durations on the surface of lapped and polished Si wafers to acquire square-based pyramidal structures for preventing losses from incoming sunlight which is necessary for solar cell applications. An x-ray diffractometer, scanning electron microscope, surface profilometer, and UV–Vis spectrophotometer were employed for characterizations of all processes. The results show that single-crystal Si wafers were successfully produced by the Cz method, and after the texturing process, roughness and reflectance values of the wafers significantly decreased. The wafers could be potential candidates for economical mass production.
KeywordsSilicon semiconductors wafer preparation surface modification
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- 1.W. D. Callister and D. G. Rethwisch, Materials Science and Engineering: An Introduction, 9th Edition (Wiley, 2013).Google Scholar
- 2.J. W. Mayer and S. S. Lau, Electronic Materials Science: For Integrated Circuits in Si and GaAs (Macmillan, 1990).Google Scholar
- 3.P. J. Reddy, Science & Technology of Photovoltaics (BS Publications, 2010).Google Scholar
- 4.W. Heywang and K. H. Zaininger, in Silicon (Springer Berlin Heidelberg, Berlin, Heidelberg, 2004), pp. 25–42.Google Scholar
- 8.Y. Han, X. Yu, D. Wang, and D. Yang, J. Nanomater. 2013, 1 (2013).Google Scholar
- 9.I. Zubel, Sensors Actuators. A Phys. 84, 116 (2000).Google Scholar
- 10.O. Anttila, Czochralski Growth of Silicon Crystals (Elsevier Inc, 2015).Google Scholar
- 12.M. Tilli, Handbook of Silicon Based MEMS Materials and Technologies, 2nd edn. (2015), p. 86.Google Scholar
- 14.S. M. Iftiquar, Y. Lee, M. Ju, N. Balaji, S. Kumar, and J. Yi, Photodiodes—From Fundamentals to Applications (2012).Google Scholar
- 15.J. D. Rachwal, X-Ray Diffraction Applications in Thin Films and (100) Silicon Substrate Stress Analysis, University of South Florida (2010).Google Scholar
- 16.F. J. Cadieu, I. Vander, Y. Rong, and R. W. Zuneska, 54, 162 (2011).Google Scholar