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Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering

  • Weiyuan YuEmail author
  • Yingzong Liu
  • Yun Liu
Article

Abstract

Interfacial intermetallic compounds (IMCs) help determine the reliability of soldered joints; thus, it is necessary to understand their formation and evolution. This study focus on Cu-Sn IMCs formed in ultrasonic-assisted soldering (UAS), wherein the formation of IMCs at the Sn/Cu interface is controlled by changing the ultrasonic action time. After being subjected to ultrasonic vibration, the IMCs at the Cu/Sn solid–liquid interface are continuously crushed, dissolved, and formed, which occurs successively in the Cu6Sn5 and Cu3Sn layers. The relationship between the thickness of the IMC layer and ultrasonic action time in Cu-Sn samples was identified. Simultaneously, the growth pattern of Cu6Sn5 grains in the Sn solder is transformed, and the tin solder (Sn solder) is kept in a dynamic non-equilibrium state with IMCs at the Sn/Cu interface through UAS. More Cu6Sn5 grains formed and were evenly distributed in the joint after cooling, which improves the performance of the joints.

Keywords

Ultrasonic-assisted soldering interfacial intermetallic compounds microstructure tin solder 

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Notes

Acknowledgments

This work was supported financially by the National Natural Science Foundation of China (Nos.51465032 and 51665031).

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Copyright information

© The Minerals, Metals & Materials Society 2019

Authors and Affiliations

  1. 1.State Key Laboratory of Gansu Province, Advanced Processing and Recycling of Nonferrous MetalsLanzhou University of TechnologyLanzhouPeople’s Republic of China

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