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Thermoelectric Properties of Thiospinel-Type CuCo2S4

  • Yudong Lang
  • Lin Pan
  • Changchun Chen
  • Yifeng WangEmail author
Article
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Abstract

Eco-friendly thiospinel-type CuCo2S4 material has been investigated as a potential thermoelectric material. The temperature, T, dependence of electrical resistivity, ρ, of CuCo2S4 shows a metallic conductivity (∂ρ/∂T > 0) and a strong degenerate state, in the range of 323–723 K. Besides a high carrier concentration consistent with the metallic nature, its Hall mobility is still unexpectedly estimated to be 8.5 cm2 V−1 s−1 at room temperature. The positive Seebeck coefficient S confirms a p-type carrier conduction. Similar to most of the transition-metal spinel chalcogenides, the S value is very low, 12–36 μV K−1 at 323–723 K. As a result, a relatively low power factor PF&!thinsp; ∼ 0.35 mW m−1 K−2 was obtained at 723 K. Due to the dominant role of electronic thermal conductivity, the total thermal conductivity к was high and increases with a linear dependence on T. However, the intrinsic lattice conductivity кl was relatively low, ranging from 1.48 W m−1 K−1 at 323 K to 0.57 W m−1 K−1 at 723 K. It follows there is a T−1 dependence indicative of Umklapp type phonon–phonon interaction. Importantly, the intrinsically low кl in CuCo2S4 is attributed to multiple mechanisms, mainly including the large unit cell with primarily octahedral coordination, the high distortion and complexity of the structure, and additional interfacial thermal resistance.

Keywords

Thiospinel CuCo2S4 thermoelectric metallic lattice thermal conductivity 

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Notes

Acknowledgments

This research was supported by the Natural Science Foundation of China under Grant Nos. 51272103, 51672127 and the Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD).

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Copyright information

© The Minerals, Metals & Materials Society 2019

Authors and Affiliations

  • Yudong Lang
    • 1
  • Lin Pan
    • 1
    • 2
  • Changchun Chen
    • 1
    • 2
  • Yifeng Wang
    • 1
    • 2
    Email author
  1. 1.College of Materials Science and EngineeringNanjing Tech UniversityNanjingChina
  2. 2.Jiangsu Collaborative Innovation Center for Advanced Inorganic Function CompositesNanjing Tech UniversityNanjingChina

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