Preparation of Ag Nanoparticles Coated with Silver Stearate for Low-Temperature Sinter-Bonding
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Silver nanoparticles (NPs) coated with silver stearate [CH3(CH2)16COOAg] have been prepared using a thermal decomposition method. Near-spherical Ag NPs with average size of 4.4 nm were obtained after thermal decomposition at 523 K. The effects of the organic acid and thermal decomposition temperature on the characteristics of the Ag NPs were investigated. For stearic acid and lauric acid with straight-chain structure, a longer chain of the organic acid contributes to the achievement of Ag NPs of smaller size, while ascorbic acid with cyclic structure results in relatively large-sized (approximately 11.7 nm) Ag NPs. Small-sized Ag NPs with uniform size distribution were obtained after thermal decomposition at temperature of 473 K or 523 K. However, after thermal decomposition at temperature of 573 K, the particle size of the Ag NPs increased and obvious aggregation occurred, which may be caused by the absence of the silver stearate coating. Low-temperature sinter-bonding of bare Cu was realized using Ag NP paste at 623 K under pressure of 5 MPa in air atmosphere. The microstructure of the joint revealed formation of a dense sintered Ag filler layer and its favorable interfacial bonding with the Cu substrates.
KeywordsAg nanoparticles low-temperature sinter-bonding organic acid thermal decomposition temperature
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This work was financially supported by the National Natural Science Foundation of China (Grant No. 51304148).
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