Journal of Electronic Materials

, Volume 48, Issue 5, pp 2745–2753 | Cite as

Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes

  • Haijiao Zhan
  • Jiayu GuoEmail author
  • Jiali Shen
  • Xiaorong Wang
  • Zhonghua Fan
  • Bing Guo
  • Wei Liu
  • Hangyan Shen


Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μm to 1.5 μm and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × 10−6 Ω m. More importantly, the prepared screen-printed patterns exhibited excellent durability in terms of peel strength and folding endurance.


Silver flakes printable electronics solution-phase chemical reduction method screen printing 


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This work is partially supported by the Natural Science Foundation of Zhejiang (LY16F050005) and the Major Research and Development Project of Zhejiang Province (2017C01SA170345).


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Copyright information

© The Minerals, Metals & Materials Society 2019

Authors and Affiliations

  • Haijiao Zhan
    • 1
  • Jiayu Guo
    • 1
    Email author
  • Jiali Shen
    • 1
  • Xiaorong Wang
    • 2
  • Zhonghua Fan
    • 2
  • Bing Guo
    • 1
  • Wei Liu
    • 1
  • Hangyan Shen
    • 1
  1. 1.College of Materials Science and EngineeringChina Jiliang UniversityHangzhouPeople’s Republic of China
  2. 2.Hangzhou Huaguang Advanced Welding Materials Co., LTDHangzhouPeople’s Republic of China

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